Dr Ohidul Alam

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Y C ChanCity University of Hong KongVerified email at cityu.edu.hk
Hau Ping ChanCity University of Hong KongVerified email at cityu.edu.hk
Sabuj MallikProfessor & Head of School of Engineering & the Built Environment, Buckinghamshire New University UKVerified email at bucks.ac.uk
Dr Emeka Amalu [BEng (Hons), MEng,...Associate Professor of Mechanical Engineering, Teesside University, Middlesbrough, UKVerified email at tees.ac.uk
Libor RuferSenior Scientist at University of Grenoble-Alpes, FranceVerified email at univ-grenoble-alpes.fr
Dr Mathias EkpuAssociate Professor, Mechanical Engineering Department, Delta State University, AbrakaVerified email at delsu.edu.ng

Dr Ohidul Alam

Lumentum - Telecommunication

Verified email at lumentum.com

Reliability Failure Analysis Electronics/Optoelectronics Automobile Materials


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Response of Ti–6Al–4V and Ti–24Al–11Nb alloys to dry sliding wear against hardened steel MO Alam, A Haseeb Tribology International 35 (6), 357-362, 2002	212	2002
Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder RA Islam, BY Wu, MO Alam, YC Chan, W Jillek Journal of alloys and compounds 392 (1-2), 149-158, 2005	170	2005
Reliability study of the electroless Ni–P layer against solder alloy MO Alam, YC Chan, KC Hung Microelectronics Reliability 42 (7), 1065-1073, 2002	147	2002
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges KC Otiaba, NN Ekere, RS Bhatti, S Mallik, MO Alam, EH Amalu Microelectronics Reliability 51 (12), 2031-2043, 2011	145	2011
Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni (P)/Cu bond pad MO Alam, YC Chan, KN Tu Journal of Applied Physics 94 (6), 4108-4115, 2003	140	2003
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film MA Uddin, MO Alam, YC Chan, HP Chan Microelectronics Reliability 44 (3), 505-514, 2004	125	2004
Effect of 0.5 wt% Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization MO Alam, YC Chan, KN Tu Journal of Applied Physics 94 (12), 7904-7909, 2003	97	2003
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3. 5Ag0. 5Cu solder alloy MN Islam, YC Chan, A Sharif, MO Alam Microelectronics Reliability 43 (12), 2031-2037, 2003	88	2003
High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints MO Alam, BY Wu, YC Chan, KN Tu Acta materialia 54 (3), 613-621, 2006	80	2006
Effect of 0.5 wt% Cu in Sn− 3.5% Ag solder on the interfacial reaction with Au/Ni metallization MO Alam, YC Chan, KN Tu Chemistry of materials 15 (23), 4340-4342, 2003	79	2003
Electrochemical corrosion study of Pb-free solders BY Wu, YC Chan, MO Alam, W Jillek Journal of materials research 21, 62-70, 2006	71	2006
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad S Ou, Y Xu, KN Tu, MO Alam, YC Chan Proceedings Electronic Components and Technology, 2005. ECTC'05., 467-471, 2005	71	2005
Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints WH Zhong, YC Chan, MO Alam, BY Wu, JF Guan Journal of alloys and compounds 414 (1-2), 123-130, 2006	68	2006
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications CY Yin, MO Alam, YC Chan, C Bailey, H Lu Microelectronics Reliability 43 (4), 625-633, 2003	68	2003
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization JH Zhang, YC Chan, MO Alam, S Fu Microelectronics Reliability 43 (8), 1303-1310, 2003	66	2003
Elimination of Au-embrittlement in solder joints on Au/Ni metallization MO Alam, YC Chan, KN Tu Journal of materials Research 19, 1303-1306, 2004	65	2004
Solid-state growth kinetics of Ni3Sn4 at the Sn–3.5 Ag solder∕ Ni interface MO Alam, YC Chan Journal of applied physics 98 (12), 2005	62	2005
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu Microelectronics Reliability 52 (7), 1409-1419, 2012	60	2012
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages YP Wu, MO Alam, YC Chan, BY Wu Microelectronics Reliability 44 (2), 295-302, 2004	55	2004
Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow MO Alam, YC Chan, KC Hung Journal of electronic materials 31, 1117-1121, 2002	54	2002

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