Robert Kay
Cited by
Cited by
Nanosecond laser textured superhydrophobic metallic surfaces and their chemical sensing applications
DV Ta, A Dunn, TJ Wasley, RW Kay, J Stringer, PJ Smith, C Connaughton, ...
Applied Surface Science 357, 248-254, 2015
Laser textured superhydrophobic surfaces and their applications for homogeneous spot deposition
A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ...
Applied Surface Science 365, 153-159, 2016
Laser textured surface gradients
A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ...
Applied Surface Science 371, 583-589, 2016
Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing
J Li, T Monaghan, TT Nguyen, RW Kay, RJ Friel, RA Harris
Composites Part B: Engineering 113, 342-354, 2017
Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process
RW Kay, S Stoyanov, GP Glinski, C Bailey, MPY Desmulliez
IEEE Transactions on Components and packaging technologies 30 (1), 129-136, 2007
Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications
GJ Jackson, MW Hendriksen, RW Kay, M Desmulliez, RK Durairaj, ...
Soldering & Surface Mount Technology, 2005
Hybrid additive manufacturing of 3D electronic systems
J Li, T Wasley, TT Nguyen, VD Ta, JD Shephard, J Stringer, P Smith, ...
Journal of Micromechanics and Microengineering 26 (10), 105005, 2016
A review of stencil printing for microelectronic packaging
R Kay, M Desmulliez
Soldering & Surface Mount Technology, 2012
A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing
NJ Wilkinson, MAA Smith, RW Kay, RA Harris
The International Journal of Advanced Manufacturing Technology 105 (11 …, 2019
Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys
RW Kay, E De Gourcuff, MPY Desmulliez, GJ Jackson, HAH Steen, C Liu, ...
Proceedings Electronic Components and Technology, 2005. ECTC'05., 848-854, 2005
Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip
GJ Jackson, MW Hendriksen, RK Durairaj, NN Ekere, MPY Desmulliez, ...
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
S Costello, N Strusevich, D Flynn, RW Kay, MK Patel, C Bailey, D Price, ...
Microsystem technologies 19 (6), 783-790, 2013
A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide
J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ...
Advanced Functional Materials 28 (6), 1704451, 2018
Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality
J Stringer, TM Althagathi, CCW Tse, VD Ta, JD Shephard, E Esenturk, ...
Manufacturing Review 3, 2016
Learning to collaborate and collaborating to learn: An experiential approach to teaching collaborative systems
R Kay, LE Dyson
Journal of Theoretical and Applied Electronic Commerce Research 1 (2), 36-44, 2006
Dynamically controlled deposition of colloidal nanoparticle suspension in evaporating drops using laser radiation
VD Ta, RM Carter, E Esenturk, C Connaughton, TJ Wasley, J Li, RW Kay, ...
Soft Matter 12 (20), 4530-4536, 2016
Additively manufactured heterogeneous substrates for three-dimensional control of local permittivity
J Tribe, WG Whittow, RW Kay, JC Vardaxoglou
Electronics letters 50 (10), 745-746, 2014
Microstructure formation in a thick polymer by electrostatic-induced lithography
G Liu, W Yu, H Li, J Gao, D Flynn, RW Kay, S Cargill, C Tonry, MK Patel, ...
Journal of Micromechanics and Microengineering 23 (3), 035018, 2013
Optimization and characterization of drop-on-demand inkjet printing process for platinum organometallic inks
G Cummins, R Kay, J Terry, MPY Desmulliez, AJ Walton
2011 IEEE 13th Electronics Packaging Technology Conference, 256-261, 2011
A High Volume, Low Cost and Low Temperature MEMS Packaging Technology Based on a Flip-Chip Assembly Process
JG Robert William Kay, Marc P. Y. Desmulliez, S
Micro.Tec, 123-128, 2003
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