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Co-authors
Branislav HredzakUniversity of New South Wales, Sydney, AustraliaVerified email at unsw.edu.au- Ben M. ChenProfessor, Chinese University of Hong Kong and National University of SingaporeVerified email at ieee.org
- T. H. LeeProfessor of Electrical and Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
- Chee Khiang Pang (Justin)National University of SingaporeVerified email at nus.edu.sg
- Abhishek DhandaCamera Systems, AppleVerified email at stanfordalumni.org
- Guido HerrmannUniversity of ManchesterVerified email at manchester.ac.uk
- Wei GuoMolex, Western Digital, HGST, Maxtor, DSIVerified email at molex.com
- Lihua XieProfessor of Electrical Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Jinchuan ZhengAssociate Professor of Robotics and Mechatronics, Swinburne University of Technology, MelbourneVerified email at swin.edu.au
- David John HILLProfessor, University of NSW Sydney, AustraliaVerified email at sydney.edu.au
- Abdullah Al MamunAssoc. Prof. of Electrical & Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
- Sam GeNational University of SingaporeVerified email at nus.edu.sg
- Matthew C. TurnerUniversity of SouthamptonVerified email at soton.ac.uk
- Ian PostlethwaiteNewcastle UniversityVerified email at newcastle.ac.uk
- F.L. Lewisprofessor of electrical engineering, The University of Texas at ArlingtonVerified email at uta.edu
- Hui LiWestern Digital, PhD from Nanyang Technological UniversityVerified email at e.ntu.edu.sg
- S. Craig SmithWestern Digital CorporationVerified email at wdc.com
- Daqing Zhang, IEEE FellowChair Professor, Telecom SudParis/Peking UniversityVerified email at telecom-sudparis.eu
- Xu ChenUniversity of WashingtonVerified email at uw.edu
- Minghui ZhengUniversity at BuffaloVerified email at buffalo.edu
Guoxiao Guo
Verified email at wdc.com