| Scaling effects in perovskite ferroelectrics: fundamental limits and process‐structure‐property relations JF Ihlefeld, DT Harris, R Keech, JL Jones, JP Maria, S Trolier‐McKinstry Journal of the American Ceramic Society 99 (8), 2537-2557, 2016 | 200 | 2016 |
| 3-D self-aligned stacked NMOS-on-PMOS nanoribbon transistors for continued Moore’s law scaling CY Huang, G Dewey, E Mannebach, A Phan, P Morrow, W Rachmady, ... 2020 IEEE International Electron Devices Meeting (IEDM), 20.6. 1-20.6. 4, 2020 | 71 | 2020 |
| Lateral scaling of Pb (Mg1/3Nb2/3) O3-PbTiO3 thin films for piezoelectric logic applications R Keech, S Shetty, MA Kuroda, X Hu Liu, GJ Martyna, DM Newns, ... Journal of Applied Physics 115 (23), 2014 | 43 | 2014 |
| Declamped piezoelectric coefficients in patterned 70/30 lead magnesium niobate–lead titanate thin films R Keech, L Ye, JL Bosse, G Esteves, J Guerrier, JL Jones, MA Kuroda, ... Advanced Functional Materials 27 (9), 1605014, 2017 | 36 | 2017 |
| Pathway to the piezoelectronic transduction logic device PM Solomon, BA Bryce, MA Kuroda, R Keech, S Shetty, TM Shaw, ... Nano letters 15 (4), 2391-2395, 2015 | 33 | 2015 |
| Thickness‐dependent domain wall reorientation in 70/30 lead magnesium niobate‐lead titanate thin films R Keech, C Morandi, M Wallace, G Esteves, L Denis, J Guerrier, ... Journal of the American Ceramic Society 100 (9), 3961-3972, 2017 | 14 | 2017 |
| Management of lead content for growth of {001}‐oriented lead magnesium niobate‐lead titanate thin films R Keech, S Shetty, K Wang, S Trolier‐McKinstry Journal of the American Ceramic Society 99 (4), 1144-1146, 2016 | 13 | 2016 |
| Arsenic-doped epitaxial, source/drain regions for NMOS A Murthy, R Keech, NG Minutillo, R Jhaveri US Patent 11,610,889, 2023 | 11 | 2023 |
| Source or drain structures with phosphorous and arsenic co-dopants A Murthy, R Keech, NG Minutillo, S Vishwanath US Patent 11,552,169, 2023 | 11 | 2023 |
| Contact resistance reduction in transistor devices with metallization on both sides K Ganguly, R Keech, S Rafique, GA Glass, AS Murthy, E Mannebach, ... US Patent App. 16/911,771, 2021 | 11 | 2021 |
| The PiezoElectronic switch: A path to low energy electronics PM Solomon, B Bryce, R Keech, TM Shaw, M Copel, LW Hung, A Schrott, ... 2013 Third Berkeley Symposium on Energy Efficient Electronic Systems (E3S), 1-2, 2013 | 7 | 2013 |
| Source or drain structures for germanium n-channel devices R Keech, B Chu-Kung, S Rafique, D Merrill, A Agrawal, H Kennel, Y Cao, ... US Patent App. 16/368,088, 2020 | 4 | 2020 |
| Dimensional Scaling of Perovskite Ferroelectric Thin Films RR Keech | 4 | 2016 |
| Source or drain structures with vertical trenches R Keech, N Minutillo, A Murthy, A Budrevich, P Wells US Patent 11,935,887, 2024 | 3 | 2024 |
| Gate-all-around integrated circuit structures having strained source or drain structures on insulator A Agrawal, AS Murthy, C Bomberger, JT Kavalieros, K Ganguly, R Keech, ... US Patent App. 16/912,127, 2021 | 2 | 2021 |
| Three-dimensional integrated circuits (3DICs) including upper-level transistors with epitaxial source and drain material A Agrawal, G Dewey, CY Huang, W Rachmady, A Murthy, R Keech, ... US Patent 11,164,785, 2021 | 2 | 2021 |
| Top gate recessed channel CMOS thin film transistor in the back end of line and methods of fabrication G Dewey, R Keech, C Bomberger, CY Huang, A Agrawal, W Rachmady, ... US Patent 11,328,988, 2022 | 1 | 2022 |
| Gate-all-around integrated circuit structures having strained source or drain structures on gate dielectric layer A Agrawal, AS Murthy, JT Kavalieros, K Ganguly, R Keech, S Chouksey, ... US Patent App. 16/912,136, 2021 | 1 | 2021 |
| Gate-all-around integrated circuit structures having strained dual nanoribbon channel structures A Agrawal, B Mueller, JT Kavalieros, J Torres, K Jun, S Chouksey, ... US Patent App. 16/913,333, 2021 | 1 | 2021 |
| TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF FABRICATION G Dewey, R Keech, C Bomberger, C Huang, A Agrawal, W Rachmady, ... US Patent App. 18/395,192, 2024 | | 2024 |
Susan Trolier-McKinstrySteward S. Flaschen Professor of Ceramic Science and Engineering and Electrical Eng., Penn StateVerified email at psu.edu
