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Tae-Kyu Lee
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Year
Effect of inclusion size on the nucleation of acicular ferrite in welds
TK Lee, K HJ
ISIJ international 40 (12), 1260-1268, 2000
2892000
Fundamentals of lead-free solder interconnect technology
TK Lee, TR Bieler, C Kim, H Ma
Springer (US) chapter 1, 1-20, 2015
1412015
The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints
TR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ...
Journal of Electronic Materials 41, 283-301, 2012
1192012
Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects
TK Lee, H Ma, KC Liu, J Xue
Journal of Electronic Materials 39, 2564-2573, 2010
1012010
Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy
TK Lee, B Zhou, L Blair, KC Liu, TR Bieler
Journal of electronic materials 39, 2588-2597, 2010
832010
Crack development in a low-stress PBGA package due to continuous recrystallization leading to formation of orientations with [001] parallel to the interface
B Zhou, TR Bieler, TK Lee, KC Liu
Journal of electronic materials 39, 2669-2679, 2010
732010
Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints
P Darbandi, TR Bieler, F Pourboghrat, T Lee
Journal of electronic materials 42, 201-214, 2013
632013
Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish
CF Tseng, TK Lee, G Ramakrishna, KC Liu, JG Duh
Materials Letters 65 (21-22), 3216-3218, 2011
622011
Methodology for analyzing slip behavior in ball grid array lead-free solder joints after simple shear
B Zhou, TR Bieler, TK Lee, KC Liu
Journal of electronic materials 38, 2702-2711, 2009
622009
The corrosion of stainless steel made by additive manufacturing: A review
G Ko, W Kim, K Kwon, TK Lee
Metals 11 (3), 516, 2021
522021
Microstructure and orientation evolution of the Sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints
TK Lee, KC Liu, TR Bieler
Journal of electronic materials 38, 2685-2693, 2009
492009
J. Electron. Mater.
TK Lee, B Zhou, T Bieler, KC Liu
J. Electron. Mater 34 (1), 1-11, 2005
452005
Slip, crystal orientation, and damage evolution during thermal cycling in high-strain wafer-level chip-scale packages
B Zhou, Q Zhou, TR Bieler, T Lee
Journal of Electronic Materials 44, 895-908, 2015
422015
Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures
CY Yu, TK Lee, M Tsai, KC Liu, JG Duh
Journal of electronic materials 39, 2544-2552, 2010
422010
The effect of cooling rate on grain orientation and misorientation microstructure of SAC105 solder joints before and after impact drop tests
P Darbandi, TR Bieler, F Pourboghrat, T Lee
Journal of electronic materials 43, 2521-2529, 2014
392014
Impact of 5% NaCl salt spray pretreatment on the long-term reliability of wafer-level packages with Sn-Pb and Sn-Ag-Cu solder interconnects
B Liu, TK Lee, KC Liu
Journal of electronic materials 40, 2111-2118, 2011
362011
The influence of an imposed current on the creep of Sn-Ag-Cu solder
C Kinney, JW Morris, TK Lee, KC Liu, J Xue, D Towne
Journal of Electronic Materials 38, 221-226, 2009
362009
Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD
B Zhou, TR Bieler, TK Lee, W Liu
Journal of electronic materials 42, 319-331, 2013
342013
Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints
P Darbandi, T Lee, TR Bieler, F Pourboghrat
Computational materials science 85, 236-243, 2014
332014
Improved strength of boron-doped Sn-1.0 Ag-0.5 Cu solder joints under aging conditions
H Choi, TK Lee, Y Kim, H Kwon, CF Tseng, JG Duh, H Choe
Intermetallics 20 (1), 155-159, 2012
322012
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Articles 1–20