Defect detection inside a rail head by ultrasonic guided waves J Xie, W Ding, W Zou, T Wang, J Yang Symmetry 14 (12), 2566, 2022 | 11 | 2022 |
Modeling and experimental characterization of bonding delaminations in single-element ultrasonic transducer W Ding, M Bavencoffe, M Lethiecq Materials 14 (9), 2269, 2021 | 6 | 2021 |
Health monitoring of single-element piezoelectric transducer using its electromechanical admittance W Ding, M Bavencoffe, M Lethiecq IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 68 …, 2020 | 6 | 2020 |
Modeling and experimental characterization of bonding delamination in linear array ultrasonic transduer W Ding, M Bavencoffe, M Lethiecq 2021 IEEE International Ultrasonics Symposium (IUS), 1-4, 2021 | 3 | 2021 |
Accurate coupled vibration analysis of a piezoelectric ceramic cylinder by the superposition method W Ding, M Bavencoffe, M Lethiecq Ultrasonics 115, 106474, 2021 | 3 | 2021 |
Accurate coupled vibration analysis of a piezoelectric array element by the superposition method W Ding, M Bavencoffe, M Lethiecq Journal of Sound and Vibration 514, 116438, 2021 | 2 | 2021 |
An Original 2-D Analytical Model for Investigating Coupled Vibrations of Finite Piezoelectric Resonators W Ding, M Bavencoffe, M Lethiecq IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 69 …, 2021 | 2 | 2021 |
A semi-analytical wavelet finite element method for wave propagation in rectangular rods W Ding, L Li, H Zhong, Y Li, D Bao, S Wei, W Wang Wave Motion 128, 103325, 2024 | | 2024 |
Dynamic stiffness formulation for a piezoelectric array element W Ding, M Bavencoffe, M Lethiecq Journal of Sound and Vibration 561, 117843, 2023 | | 2023 |
Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric Transducer W Ding, M Bavencoffe, M Lethiecq Forum Acusticum, 2857-2862, 2020 | | 2020 |