| TP-GNN: A graph neural network framework for tier partitioning in monolithic 3D ICs YC Lu, SSK Pentapati, L Zhu, K Samadi, SK Lim 2020 57th ACM/IEEE Design Automation Conference (DAC), 1-6, 2020 | 57 | 2020 |
| Macro-3D: A physical design methodology for face-to-face-stacked heterogeneous 3D ICs L Bamberg, L Zhu, S Pentapati, DE Shim, A García-Ortiz Proc. Design Autom. Test Eur. Conf. Exhib., 1-6, 2020 | 30 | 2020 |
| Heterogeneous 3D integration for a RISC-V system with STT-MRAM L Zhu, L Bamberg, A Agnesina, F Catthoor, D Milojevic, M Komalan, ... IEEE Computer Architecture Letters 19 (1), 51-54, 2020 | 18 | 2020 |
| A logic-on-memory processor-system design with monolithic 3-D technology S Pentapati, L Zhu, L Bamberg, A García-Ortiz, SK Lim IEEE Micro 39 (6), 38-45, 2019 | 14 | 2019 |
| Architecture, dataflow and physical design implications of 3D-ICs for DNN-accelerators JM Joseph, A Samajdar, L Zhu, R Leupers, SK Lim, T Pionteck, T Krishna 2021 22nd International Symposium on Quality Electronic Design (ISQED), 60-66, 2021 | 9 | 2021 |
| High-performance logic-on-memory monolithic 3-D IC designs for arm Cortex-A processors L Zhu, L Bamberg, SSK Pentapati, K Chang, F Catthoor, D Milojevic, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 29 (6 …, 2021 | 7 | 2021 |
| Micro-bumping, hybrid bonding, or monolithic? A PPA study for heterogeneous 3D IC options J Kim, L Zhu, HM Torun, M Swaminathan, SK Lim 2021 58th ACM/IEEE Design Automation Conference (DAC), 1189-1194, 2021 | 6 | 2021 |
| Vortex: OpenCL Compatible RISC-V GPGPU F Elsabbagh, B Tine, P Roshan, E Lyons, E Kim, DE Shim, L Zhu, SK Lim arXiv preprint arXiv:2002.12151, 2020 | 6 | 2020 |
| A machine learning-powered tier partitioning methodology for monolithic 3-D ICs YC Lu, S Pentapati, L Zhu, G Murali, K Samadi, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 5 | 2021 |
| Power delivery and thermal-aware arm-based multi-tier 3D architecture L Zhu, T Ta, R Liu, R Mathur, X Xu, S Das, A Kaul, A Rico, D Joseph, ... 2021 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2021 | 5 | 2021 |
| Design automation and test solutions for monolithic 3D ICs L Zhu, A Chaudhuri, S Banerjee, G Murali, P Vanna-Iampikul, ... ACM Journal on Emerging Technologies in Computing Systems (JETC) 18 (1), 1-49, 2021 | 4 | 2021 |
| Full-chip electro-thermal coupling extraction and analysis for face-to-face bonded 3D ICs L Zhu, K Chang, D Petranovic, S Sinha, YS Yu, SK Lim Proceedings of the 2020 International Symposium on Physical Design, 39-46, 2020 | 3 | 2020 |
| Power delivery solutions and PPA impacts in micro-bump and hybrid-bonding 3D ICs L Zhu, C Jo, SK Lim IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 2 | 2022 |
| On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs G Murali, A Iyer, L Zhu, J Tong, FM Martínez, SR Srinivasa, T Karnik, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2023 | 1 | 2023 |
| Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits P Vanna-Iampikul, L Zhu, S Erdogan, M Kathaperumal, R Agarwal, ... 2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6, 2023 | 1 | 2023 |
| 3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs L Zhu, NE Bethur, YC Lu, Y Cho, Y Im, SK Lim Proceedings of the ACM/IEEE International Symposium on Low Power Electronics …, 2022 | 1 | 2022 |
| A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping J Kim, L Zhu, HM Torun, M Swaminathan, SK Lim IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2023 | | 2023 |
| A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node SM Shaji, L Zhu, J Yoon, SK Lim 2023 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2023 | | 2023 |
| Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps L Zhu, SK Lim 2023 60th ACM/IEEE Design Automation Conference (DAC), 1-4, 2023 | | 2023 |
| Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies L Zhu, SK Lim Proceedings of the 2021 International Symposium on Physical Design, 127-134, 2021 | | 2021 |
Sung Kyu LimProfessor, Georgia Institute of TechnologyBestätigte E-Mail-Adresse bei ece.gatech.edu
