Guo Qi Zhang
Guo Qi Zhang
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Cited by
Cited by
Nanowire-based gas sensors
X Chen, CKY Wong, CA Yuan, G Zhang
Sensors and Actuators B: Chemical 177, 178-195, 2013
Mechanics of microelectronics
GQ Zhang, WD Van Driel, XJ Fan
Springer Science & Business Media, 2006
A review of small heat pipes for electronics
X Chen, H Ye, X Fan, T Ren, G Zhang
Applied Thermal Engineering 96, 1-17, 2016
Solid state lighting reliability part 2
WD Van Driel, XJ Fan, GQ Zhang
Springer, 2017
Solid state lighting reliability part 2
WD Van Driel, XJ Fan, GQ Zhang
Springer, 2017
Thermal management on IGBT power electronic devices and modules
C Qian, AM Gheitaghy, J Fan, H Tang, B Sun, H Ye, G Zhang
IEEE Access 6, 12868-12884, 2018
Interfacial delamination mechanisms during soldering reflow with moisture preconditioning
X Fan, GQ Zhang, WD Van Driel, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
X Chen, C Yuan, CKY Wong, G Zhang
Journal of molecular modeling 18 (6), 2333-2341, 2012
A micromechanics-based vapor pressure model in electronic packages
XJ Fan, J Zhou, GQ Zhang, LJ Ernst
PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers
B Sun, X Fan, C Qian, G Zhang
IEEE Transactions on Industrial Electronics 63 (11), 6726-6735, 2016
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang
Optical Materials 35 (3), 504-508, 2013
A review of passive thermal management of LED module
H Ye, G Zhang
Journal of Semiconductors 32 (1), 014008, 2011
Degradation modeling of mid-power white-light LEDs by using Wiener process
J Huang, DS Golubović, S Koh, D Yang, X Li, X Fan, GQ Zhang
Optics express 23 (15), A966-A978, 2015
Evaluation survey of microbial disinfection methods in UV-LED water treatment systems
X Li, M Cai, L Wang, F Niu, D Yang, G Zhang
Science of the Total Environment 659, 1415-1427, 2019
Driving mechanisms of delamination related reliability problems in exposed pad packages
WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008
Prediction and verification of process induced warpage of electronic packages
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi
Microelectronics Reliability 43 (5), 765-774, 2003
Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
H Tang, Y Li, R Sokolovskij, L Sacco, H Zheng, H Ye, H Yu, X Fan, H Tian, ...
ACS applied materials & interfaces 11 (43), 40850-40859, 2019
Analysis of Cu/low-k bond pad delamination by using a novel failure index
MAJ van Gils, O van der Sluis, GQ Zhang, JHJ Janssen, RMJ Voncken
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2005
Sulfur dioxide and nitrogen dioxide gas sensor based on arsenene: a first-principle study
XP Chen, LM Wang, X Sun, RS Meng, J Xiao, HY Ye, GQ Zhang
IEEE Electron Device Letters 38 (5), 661-664, 2017
Dynamic buckling of a shallow arch under shock loading considering the effects of the arch shape
NJ Mallon, RHB Fey, H Nijmeijer, GQ Zhang
International Journal of Non-Linear Mechanics 41 (9), 1057-1067, 2006
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