| Nanowire-based gas sensors X Chen, CKY Wong, CA Yuan, G Zhang Sensors and Actuators B: Chemical 177, 178-195, 2013 | 317 | 2013 |
| Mechanics of microelectronics GQ Zhang, WD Van Driel, XJ Fan Springer Science & Business Media, 2006 | 206 | 2006 |
| Solid state lighting reliability: components to systems WD Van Driel, XJ Fan Springer Science & Business Media, 2012 | 143* | 2012 |
| A review of small heat pipes for electronics X Chen, H Ye, X Fan, T Ren, G Zhang Applied Thermal Engineering 96, 1-17, 2016 | 111 | 2016 |
| Interfacial delamination mechanisms during soldering reflow with moisture preconditioning X Fan, GQ Zhang, WD Van Driel, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008 | 89 | 2008 |
| A micromechanics-based vapor pressure model in electronic packages XJ Fan, J Zhou, GQ Zhang, LJ Ernst | 76 | 2005 |
| Molecular modeling of temperature dependence of solubility parameters for amorphous polymers X Chen, C Yuan, CKY Wong, G Zhang Journal of molecular modeling 18 (6), 2333-2341, 2012 | 71 | 2012 |
| Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang Optical Materials 35 (3), 504-508, 2013 | 66 | 2013 |
| Prediction and verification of process induced warpage of electronic packages WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi Microelectronics Reliability 43 (5), 765-774, 2003 | 61 | 2003 |
| Analysis of Cu/low-k bond pad delamination by using a novel failure index MAJ Van Gils, O van der Sluis, GQ Zhang, JHJ Janssen, RMJ Voncken EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2005 | 58 | 2005 |
| PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers B Sun, X Fan, C Qian, G Zhang IEEE Transactions on Industrial Electronics 63 (11), 6726-6735, 2016 | 56 | 2016 |
| Driving mechanisms of delamination related reliability problems in exposed pad packages WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008 | 56 | 2008 |
| Packaging induced die stresses—Effect of chip anisotropy and time-dependent behavior of a molding compound WD Van Driel, JHJ Janssen, GQ Zhang, DG Yang, LJ Ernst J. Electron. Packag. 125 (4), 520-526, 2003 | 56 | 2003 |
| Dynamic buckling of a shallow arch under shock loading considering the effects of the arch shape NJ Mallon, RHB Fey, H Nijmeijer, GQ Zhang International Journal of Non-Linear Mechanics 41 (9), 1057-1067, 2006 | 55 | 2006 |
| Impact of the functional group on the working range of polyaniline as carbon dioxide sensors X Chen, CKY Wong, CA Yuan, G Zhang Sensors and Actuators B: Chemical 175, 15-21, 2012 | 54 | 2012 |
| Response surface modeling for nonlinear packaging stresses WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst J. Electron. Packag. 125 (4), 490-497, 2003 | 54 | 2003 |
| More than Moore: creating high value micro/nanoelectronics systems GQ Zhang, A Van Roosmalen Springer Science & Business Media, 2010 | 51 | 2010 |
| Constitutive modeling of moulding compounds [electronic packaging applications] KMB Jansen, L Wang, DG Yang, C Van't Hof, LJ Ernst, HJL Bressers, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 51 | 2004 |
| Thermal management on IGBT power electronic devices and modules C Qian, AM Gheitaghy, J Fan, H Tang, B Sun, H Ye, G Zhang IEEE Access 6, 12868-12884, 2018 | 49 | 2018 |
| Degradation modeling of mid-power white-light LEDs by using Wiener process J Huang, DS Golubović, S Koh, D Yang, X Li, X Fan, GQ Zhang Optics express 23 (15), A966-A978, 2015 | 49 | 2015 |
