| Experimental investigation of a direct liquid immersion cooled prototype for high performance electronic systems JL Gess, SH Bhavnani, RW Johnson IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 35 | 2015 |
| Effect of system and operational parameters on the performance of an immersion-cooled multichip module for high performance computing B Ramakrishnan, SH Bhavnani, J Gess, RW Knight, D Harris, ... 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 20 | 2014 |
| Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model J Gess, S Bhavnani, B Ramakrishnan, RW Johnson, D Harris, RW Knight, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 18 | 2014 |
| Investigation and characterization of a high performance, small form factor, modular liquid immersion cooled server model J Gess, S Bhavnani, B Ramakrishnan, RW Johnson, D Harris, R Knight, ... 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 13 | 2014 |
| Two-phase thermosiphon cooling using integrated heat spreaders with copper microstructures V Abreu, M Harrison, J Gess, AS Moita 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 12 | 2018 |
| Experimental Investigation of a Liquid Immersion Cooled Electronics Module using Two-Phase Heat Transfer for Thermal Management JL Gess Auburn University, 2015 | 12 | 2015 |
| Numerical model of heat transfer during laser powder bed fusion of 316L stainless steel B Cox, M Ghayoor, RP Doyle, S Pasebani, J Gess The International Journal of Advanced Manufacturing Technology, 1-11, 2022 | 8 | 2022 |
| Compatibility Analysis of Liquid Gallium and Common Packaging Metals for Application in Electronic Component Thermal Management R McAfee, M Fish, D Baker, J Gess, L Boteler 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 6 | 2020 |
| Thermal resistance and PIV characterization of a line-replaceable compact liquid-cooled server module for high performance computing platforms J Gess, SH Bhavnani, RW Johnson ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014 | 6 | 2014 |
| Effect of subcooling, flow rate and surface characteristics on flow boiling performance of high performance liquid cooled immersion server model S Chandrasekaran, J Gess, S Bhavnani 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 5 | 2017 |
| Single-and two-phase particle image Velocimetry characterization of fluid flow within a liquid immersion cooled electronics module J Gess, S Bhavnani, R Wayne Johnson Journal of Electronic Packaging 138 (4), 041007, 2016 | 5 | 2016 |
| Characterization of net coolant flow rate to copper boiling surfaces using two-phase particle image Velocimetry and dielectric fluid M Harrison, A Moita, J Gess Heat and Mass Transfer 56, 1811-1823, 2020 | 4 | 2020 |
| Preconceptual Design of Multifunctional Gas-Cooled Cartridge Loop for the Versatile Test Reactor: Instrumentation and Measurement—Part II P Sabharwall, K Weaver, NK Anand, C Ellis, X Sun, H Choi, D Chen, ... Nuclear Science and Engineering 196 (sup1), S215-S233, 2022 | 3 | 2022 |
| An X-band dielectric rod antenna for subdermal tumor heating to assist electroporation-mediated DNA delivery IH Uluer, MJ Jaroszeski, JL Gess, TM Weller IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology …, 2021 | 3 | 2021 |
| Thermal characterization of a virtual reality headset during transient and resting operation R McAfee, C Haxton, M Harrison, J Gess 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 3 | 2020 |
| A numerical study of multiphase dielectric fluid immersion cooling of multichip modules including effects of nucleation site density and bubble departure diameter functions J Nguyen, RW Knight, SH Bhavnani, DK Harris, S Fincher, J Gess, ... ASME International Mechanical Engineering Congress and Exposition 57496 …, 2015 | 3 | 2015 |
| Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules J Gess, T Dreher, S Bhavnani, RW Johnson ASME 2015 International Technical Conference and Exhibition on Packaging and …, 2015 | 3 | 2015 |
| Tracking of Marangoni driven motion during laser powder bed fusion B Cox, M Ghayoor, S Pasebani, J Gess Powder Technology 425, 118610, 2023 | 2 | 2023 |
| Preconceptual Design of Multifunctional Gas-Cooled Cartridge Loop for the Versatile Test Reactor—Part I P Sabharwall, K Weaver, NK Anand, C Ellis, X Sun, D Chen, H Choi, ... Nuclear Science and Engineering 196 (sup1), S183-S214, 2022 | 2 | 2022 |
| Zener Diode Reverse Breakdown Voltage as a Simultaneous Heating and Temperature Sensing Element R McAfee, M Fish, J Gess 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 2 | 2022 |
Daniel Kevin HarrisAssociate Professor, Mechanical Engineering, Auburn UniversityVerified email at eng.auburn.edu
