| Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives MH Malik, G Grosso, H Zangl, A Binder, A Roshanghias Microelectronics Reliability 123, 114204, 2021 | 30 | 2021 |
| ACF bonding technology for paper-and PET-based disposable flexible hybrid electronics DJ Yoon, MH Malik, P Yan, KW Paik, A Roshanghias Journal of Materials Science: Materials in Electronics 32 (2), 2283-2292, 2021 | 14 | 2021 |
| Die-level thinning for flip-chip integration on flexible substrates MH Malik, A Tsiamis, H Zangl, A Binder, S Mitra, A Roshanghias Electronics 11 (6), 849, 2022 | 9 | 2022 |
| Sinterconnects: All-copper top-side interconnects based on copper sinter paste for power module packaging A Roshanghias, P Malago, J Kaczynski, T Polom, J Bardong, D Holzmann, ... Energies 14 (8), 2176, 2021 | 5 | 2021 |
| Sustainable multifunctional biface sensor tag L Rauter, J Zikulnig, T Moldaschl, M Lenzhofer, S Khan, L Neumaier, ... Advanced Sensor Research 2 (3), 2200027, 2023 | 3 | 2023 |
| Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers MH Malik, L Rauter, H Zangl, A Binder, A Roshanghias 2022 IEEE International Conference on Flexible and Printable Sensors and …, 2022 | 3 | 2022 |
| Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation MH Malik, J Kaczynski, H Zangl, A Roshanghias Flexible and Printed Electronics 8 (1), 015004, 2023 | 1 | 2023 |
| Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders AD Rodrigues, T Weissbach, MH Malik, W Schmidt, R Gumbiowski, ... Journal of Materials Science: Materials in Electronics 33 (24), 19252-19262, 2022 | 1 | 2022 |
| Eco-Conscious Approach to Wireless Gas Monitoring with a Hybrid Printed Passive Sensor Tag J Zikulnig, MH Malik, L Rauter, M Lenzhofer, S Carrar, J Kosel IEEE Sensors Letters, 2024 | | 2024 |
| Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers MH Malik, M Khan, S Khan, A Roshanghias Proceedings 97 (1), 153, 2024 | | 2024 |
| Eco-Conscious Approach to Wireless Gas Monitoring: Development of a Hybrid NFC Sensor Tag J Zikulnig, L Rauter, MH Malik, L Neumaier, S Carrara, J Kosel LOPEC 2024: International Exhibition and Conference for Flexible, Organic …, 2024 | | 2024 |
| Future Thread: Printing Electronics on Fibers M Jose, E Bezerra Alexandre, L Neumaier, L Rauter, MT Vijjapu, ... ACS Applied Materials & Interfaces, 2024 | | 2024 |
| Integration and Packaging for Water Monitoring Systems MH Malik, A Roshanghias Sensing Technologies for Real Time Monitoring of Water Quality, 161-184, 2023 | | 2023 |
| Sustainable Multifunctional Biface Sensor Tag (Adv. Sensor Res. 3/2023) L Rauter, J Zikulnig, T Moldaschl, M Lenzhofer, S Khan, L Neumaier, ... Advanced Sensor Research 2 (3), 202370007, 2023 | | 2023 |
| Hybrid Integration of fine-pitch bare dies on polypropylene-coated paper substrates without using any adhesives or solders AD Rodrigues, T Weissbach, MH Malik, W Schmidt, R Gumbiowski, ... | | 2022 |
| Evaluation of low cost sealing methods to protect sustainable printed temperature sensors against degradation due to UV irradiation L Rauter, J Zikulnig, MH Malik, S Khan, LM Faller, H Zangl, J Kosel 2021 IEEE Sensors, 1-4, 2021 | | 2021 |
Ali RoshanghiasSilicon Austria Labs GmbHVerified email at silicon-austria.com
