Rohitkumar H. Vora
Rohitkumar H. Vora
Polymer Materials Scientist & Technology Advisor
Verified email at apr-technologies.com
Title
Cited by
Cited by
Year
Gas transport properties of 6FDA‐durene/1, 4‐phenylenediamine (pPDA) copolyimides
WH Lin, RH Vora, TS Chung
Journal of Polymer Science Part B: Polymer Physics 38 (21), 2703-2713, 2000
2382000
The effect of shear rates on gas separation performance of 6FDA-durene polyimide hollow fibers
TS Chung, WH Lin, RH Vora
Journal of Membrane Science 167 (1), 55-66, 2000
1302000
Nanoporous ultra‐low‐κ films prepared from fluorinated polyimide with grafted poly (acrylic acid) side chains
WC Wang, RH Vora, ET Kang, KG Neoh, CK Ong, LF Chen
Advanced materials 16 (1), 54-57, 2004
1072004
Synthesis and Properties of Designed Low‐k Fluoro‐Copolyetherimides. Part 1
RH Vora, PSG Krishnan, SH Goh, TS Chung
Advanced Functional Materials 11 (5), 361-373, 2001
982001
Development of a defect-free 6FDA-durene asymmetric hollow fiber and its composite hollow fibers
TS Chung, ER Kafchinski, R Vora
Journal of membrane science 88 (1), 21-36, 1994
911994
Ultra-low-κ materials based on nanoporous fluorinated polyimide with well-defined pores via the RAFT-moderated graft polymerization process
YW Chen, WC Wang, WH Yu, ET Kang, KG Neoh, RH Vora, CK Ong, ...
Journal of Materials Chemistry 14 (9), 1406-1412, 2004
652004
Effect of diamine composition on the gas transport properties in 6FDA-durene/3, 3′-diaminodiphenyl sulfone copolyimides
SL Liu, R Wang, TS Chung, ML Chng, Y Liu, RH Vora
Journal of membrane science 202 (1-2), 165-176, 2002
622002
Synthesis and properties of fluoro‐polyetherimides
RH Vora, SH Goh, TS Chung
Polymer Engineering & Science 40 (6), 1318-1329, 2000
622000
Photosensitive polyimide polymer compositions
RHV Khanna, Dinesh N., Werner H. Mueller
US Patent 4,803,147, 1989
54*1989
Electroless plating of copper on fluorinated polyimide films modified by surface graft copolymerization with 1‐vinylimidazole and 4‐vinylpyridine
KG Wang, W. C., Vora, R. H., Kang, E. T., & Neoh
Polymer Engineering & Science 44 (2), 362–375, 2004
492004
Poly (amide-amide acid), polyamide acid, poly (esteramide acid), poly (amide-imide), polyimide, poly (esterimide) from poly arylene diamine
A Berger, RH Vora
US Patent 4,681,928, 1987
491987
Fluoro‐containing polyimide blends: Prediction and experiments
TS Chung, RH Vora, M Jaffe
Journal of Polymer Science Part A: Polymer Chemistry 29 (8), 1207-1212, 1991
481991
Polymers prepared from 4, 4'-bis [2-(3, 4-(dicarboxyphenyl) hexafluoroisopropyl] diphenyl ether dianhydride
WH Mueller, DN Khanna, RH Vora, RJ Erckel
US Patent 4,931,540, 1990
391990
Polyamide-imide polymers having fluorine-containing linking groups
PN Chen Sr, RH Vora
US Patent 4,923,960, 1990
39*1990
Process of making a shaped article from intermediate molecular weight polyimides
RH Vora
US Patent 4,933,132, 1990
381990
pH-sensitive fluorinated polyimides with grafted acid and base side chains
WC Wang, RH Vora, ET Kang, KG Neoh, DJ Liaw
Industrial & engineering chemistry research 42 (4), 784-794, 2003
302003
Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV‐induced Graft Copolymerization with 4‐Vinylpyridine
WC Wang, RKH Vora, ET Kang, KG Neoh
Macromolecular Materials and Engineering 288 (2), 152-163, 2003
272003
Preparation and Characterization of 4, 4′‐Bis (4‐aminophenoxy) diphenyl Sulfone Based Fluoropoly (ether‐imide)/Organo‐Modified Clay Nanocomposites
RH Vora, PK Pallathadka, SH Goh, TS Chung, YX Lim, TK Bang
Macromolecular Materials and Engineering 288 (4), 337-356, 2003
262003
Effect of temperature on intrinsic permeation properties of 6FDA-Durene/1, 3-phenylenediamine (mPDA) copolyimide and fabrication of its hollow fiber membranes for CO2/CH4 …
JJ Qin, TS Chung, C Cao, RH Vora
Journal of membrane science 250 (1-2), 95-103, 2005
252005
Synthesis and characterization of fluorinated polyimide with grafted poly (N-isopropylacrylamide) side chains and the temperature-sensitive microfiltration membranes
WC Wang, GT Ong, SL Lim, RH Vora, ET Kang, KG Neoh
Industrial & engineering chemistry research 42 (16), 3740-3749, 2003
252003
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