Frank Altmann
Frank Altmann
Fraunhofer IMWS
Bestätigte E-Mail-Adresse bei imws.fraunhofer.de
Titel
Zitiert von
Zitiert von
Jahr
Microscopic lock-in thermography investigation of leakage sites in integrated circuits
O Breitenstein, M Langenkamp, F Altmann, D Katzer, A Lindner, H Eggers
Review of scientific instruments 71 (11), 4155-4160, 2000
1102000
Lock-in IR-thermography-A novel tool for material and device characterization
ST Huth, O Breitenstein, A Huber, D Dantz, U Lambert, F Altmann
diffusion and defect data part B solid state phenomena, 741-746, 2002
902002
Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography
C Schmidt, F Altmann, R Schlangen, H Deslandes
2010 17th IEEE International Symposium on the Physical and Failure Analysis …, 2010
612010
Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
C Schmidt, F Altmann, O Breitenstein
Materials Science and Engineering: B 177 (15), 1261-1267, 2012
502012
Surface amorphization, sputter rate, and intrinsic stresses of silicon during low energy Ga+ focused-ion beam milling
L Pastewka, R Salzer, A Graff, F Altmann, M Moseler
Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2009
482009
Lock-in-Thermography for 3-dimensional localization of electrical defects inside complex packaged devices
C Schmidt, F Altmann, C Grosse, A Lindner, V Gottschalk
Proc. 34th Int. Symp. for Testing and Failure Analysis, 102-107, 2008
462008
3D sensor application with open through silicon via technology
J Kraft, F Schrank, J Teva, J Siegert, G Koppitsch, C Cassidy, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 560-566, 2011
422011
New developments in IR lock-in thermography
O Breitenstein, JP Rakotoniaina, F Altmann, T Riediger, M Gradhand
Proc. 30th ISTFA 595 (1), 28, 2004
412004
Fault localization and functional testing of ICs by lock-in thermography
O Breitenstein, JP Rakotoniaina, F Altmann, J Schulz, G Linse
INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 29-38, 2002
332002
Thermal failure analysis by IR lock-in thermography
O Breitenstein, C Schmidt, F Altmann, D Karg
Microelectronics failure analysis desk reference, 330-339, 2004
312004
Lock-in thermal IR imaging using a solid immersion lens
O Breitenstein, F Altmann, T Riediger, D Karg, V Gottschalk
Microelectronics Reliability 46 (9-11), 1508-1513, 2006
302006
Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
D Malta, C Gregory, M Lueck, D Temple, M Krause, F Altmann, M Petzold, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1815-1821, 2011
282011
Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
R Schlangen, H Deslandes, T Lundquist, C Schmidt, F Altmann, K Yu, ...
Microelectronics Reliability 50 (9-11), 1454-1458, 2010
242010
Innovative failure analysis techniques for 3-D packaging developments
F Altmann, M Petzold
IEEE Design & Test 33 (3), 46-55, 2016
222016
Three-dimensional hot spot localization
F Altmann, C Schmidt, R Schlangen, H Deslandes
US Patent 8,742,347, 2014
192014
Use of Lock-in thermography for nondestructive 3D defect localization on system in package and stacked-die technology
R Schlangen, S Motegi, T Nagatomo, C Schmidt, F Altmann, H Murakami, ...
proceedings of ISTFA, 68-73, 2011
192011
Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution
M Krause, F Altmann, C Schmidt, M Petzold, D Malta, D Temple
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1452-1458, 2011
182011
Micro structure analysis for system in package components―Novel tools for fault isolation, target preparation, and high-resolution material diagnostics
M Petzold, F Altmann, M Krause, R Salzer, C Schmidt, S Martens, W Mack, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
182010
Standard free thickness determination of thin TEM samples via backscatter electron image correlation
R Salzer, A Graff, M Simon, F Altmann
Microscopy and Microanalysis 15 (S2), 340-341, 2009
162009
Application of Lock-in-Thermography for 3d defect localisation in complex devices
C Schmidt, F Altmann, F Naumann, A Lindner
2008 2nd Electronics System-Integration Technology Conference, 1041-1044, 2008
162008
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