| CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems L Siddhu, R Kedia, S Pandey, M Rapp, A Pathania, J Henkel, ... ACM Transactions on Architecture and Code Optimization 19 (3), 1-25, 2022 | 17 | 2022 |
| Leakage-aware dynamic thermal management of 3D memories L Siddhu, R Kedia, PR Panda ACM Transactions on Design Automation of Electronic Systems (TODAES) 26 (2 …, 2020 | 9 | 2020 |
| PredictNcool: Leakage aware thermal management for 3D memories using a lightweight temperature predictor L Siddhu, PR Panda ACM Transactions on Embedded Computing Systems (TECS) 18 (5s), 1-22, 2019 | 7 | 2019 |
| FastCool: Leakage aware dynamic thermal management of 3D memories L Siddhu, PR Panda 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE), 272-275, 2019 | 6 | 2019 |
| CoreMemDTM: Integrated processor core and 3D memory dynamic thermal management for improved performance L Siddhu, R Kedia, PR Panda 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2022 | 5 | 2022 |
| Operand isolation with reduced overhead for low power datapath design L Siddhu, A Mishra, V Singh 2014 27th International Conference on VLSI Design and 2014 13th …, 2014 | 3 | 2014 |
| Thermal aware runtime management of 3D memory architecture L Siddhu, PR Panda CSI transactions on ICT 5, 129-134, 2017 | 2 | 2017 |
| NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching S Pandey, L Siddhu, PR Panda ACM Transactions on Design Automation of Electronic Systems 29 (1), 1-35, 2023 | 1 | 2023 |
| Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure L Siddhu, A Bagchi, R Kedia, I Ahmad, S Pandey, PR Panda ACM Transactions on Embedded Computing Systems 22 (6), 1-27, 2023 | | 2023 |
| Swift-CNN: Leveraging PCM Memory’s Fast Write Mode to Accelerate CNNs L Siddhu, H Nassar, L Bauer, C Hakert, N Hölscher, JJ Chen, J Henkel IEEE Embedded Systems Letters, 2023 | | 2023 |
| Special Session-Non-Volatile Memories: Challenges and Opportunities for Embedded System Architectures with Focus on Machine Learning Applications J Henkel, L Siddhu, L Bauer, J Teich, S Wildermann, M Tahoori, ... Proceedings of the International Conference on Compilers, Architecture, and …, 2023 | | 2023 |
| Leakage aware dynamic thermal management for 3D memory architectures L Siddhu Delhi, 0 | | |
| VLSID & ES 2018–List of Reviewers A Kranti, RS Chakraborty, G Saini, A Doboli, R Patrikar, G Rao, A Kulkarni, ... | | |
Preeti Ranjan PandaProfessor in Computer Science and Engineering, Indian Institute of Technology DelhiVerified email at cse.iitd.ac.in
