| Copper device editing: Strategy for focused ion beam milling of copper JD Casey Jr, M Phaneuf, C Chandler, M Megorden, KE Noll, R Schuman, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2002 | 49 | 2002 |
| Advanced sub 0.13 µm Cu Devices–Failure Analysis and Circuit Edit With Improved FIB Chemical Processes and Beam Characteristics JD Casey Jr, TJ Gannon, A Krechmer, D Monforte, N Antoniou, N Bassom, ... International Symposium for Testing and Failure Analysis 30774, 553-557, 2002 | 8 | 2002 |
| Reliability of bipolar and MOS circuits after FIB modification R Desplats, JC Courrege, B Benteo, N Antoniou, D Monforte International Symposium for Testing and Failure Analysis, 289-298, 2001 | 7 | 2001 |
| End point of silicon milling using an optical beam induced current signal for controlled access to integrated circuits for backside circuit editing N Antoniou, NJ Bassom, C Huynh, D Monforte, JD Casey, A Krechmer, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2002 | 4 | 2002 |
| Reliability of integrated circuits modified by focused ion beam for space applications R Desplats, JC Courrege, B Benteo, N Antoniou, D Monforte European Space Components Conference, ESCCON 2002 507, 53, 2002 | 2 | 2002 |
| Ion Beam Lithography-End point of silicon milling using an optical beam induced current signal for controlled access to integrated circuits for backside circuit editing N Antoniou, NJ Bassom, C Huynh, D Monforte, JD Casey, A Krechmer, ... Journal of Vacuum Science and Technology-Section B-Microelectronics …, 2002 | | 2002 |
