| Study on the effect of ceria concentration on the silicon oxide removal rate in chemical mechanical planarization D Kwak, S Oh, J Kim, J Yun, T Kim Colloids and Surfaces A: Physicochemical and Engineering Aspects 610, 125670, 2021 | 24 | 2021 |
| A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization NY Kim, G Kim, H Sun, U Hwang, J Kim, D Kwak, IK Park, T Kim, J Suhr, ... Journal of Materials Science 57 (26), 12318-12328, 2022 | 13 | 2022 |
| Evaluation of size distribution measurement methods for sub-100 nm colloidal silica nanoparticles and its application to CMP slurry C Shin, J Choi, D Kwak, J Kim, J Yang, S Chae, T Kim ECS Journal of Solid State Science and Technology 8 (5), P3195, 2019 | 11 | 2019 |
| Effect of viscosity on ceria abrasive removal during the buff clean process J Kim, S Hong, E Kim, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... ECS Journal of Solid State Science and Technology 9 (8), 084003, 2020 | 10 | 2020 |
| Effects of aging time in hydrogen peroxide-glycine-based Cu CMP slurry J Kim, D Kwak, J Park, T Kubota, T Kim Materials Science in Semiconductor Processing 140, 106343, 2022 | 8 | 2022 |
| Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution D Kwak, J Kim, S Oh, C Bae, T Kim Review of Scientific Instruments 91 (7), 2020 | 6 | 2020 |
| Friction characteristics of molybdenum disulfide thin films synthesized via plasma sulfurization HW Yoon, K Aydin, HJ Park, S Kim, D Kwak, T Kim, C Ahn Advanced Engineering Materials 23 (12), 2100971, 2021 | 3 | 2021 |
| Investigations on the mechanism of silica particle removal during the Cu buff cleaning process P Liu, S Hong, S Jeon, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... Colloids and Surfaces A: Physicochemical and Engineering Aspects 627, 127156, 2021 | 3 | 2021 |
| Study on the effect of residual ceria slurry on chemical mechanical planarization (CMP) J Yun, D Kwak, J Kim, T Kim Microelectronic Engineering 249, 111620, 2021 | 3 | 2021 |
| Trace metals optimization in ceria abrasive for material removal rate enhancement during ILD CMP C Shin, J Choi, H Kim, A Kulkarni, D Kwak, E Kim, T Kim ECS Journal of Solid State Science and Technology 6 (10), P687, 2017 | 3 | 2017 |
| Evaluation of chemical mechanical planarization slurry dispersion using a combined scanning mobility particle sizer-optical particle sizer system D Kwak, J Kim, T Kim Aerosol Science and Technology 57 (9), 833-841, 2023 | 2 | 2023 |
| Effect of ionic strength on amorphous carbon during chemical mechanical planarization S Oh, C Shin, D Kwak, E Kim, J Kim, C Bae, T Kim Diamond and Related Materials 127, 109124, 2022 | 2 | 2022 |
| Monitoring the physicochemical degradation of polishing pad soaked in hydrogen peroxide during chemical mechanical polishing C Shin, H Chung, E Kim, S Hong, D Kwak, Y Jin, A Kulkarni, T Kim ECS Journal of Solid State Science and Technology 7 (2), P77, 2018 | 2 | 2018 |
| Size distribution measurement of mixed abrasive slurry for chemical mechanical planarization using an electrospray scanning mobility particle sizer D Kwak, J Kim, S Oh, C Bae, T Kim Colloids and Surfaces A: Physicochemical and Engineering Aspects 674, 131798, 2023 | 1 | 2023 |
| Effect of radial grooves pads on copper chemical mechanical polishing C Bae, S Oh, J Kim, D Kwak, S Oh, T Kim Materials Science in Semiconductor Processing 151, 106968, 2022 | 1 | 2022 |
| Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol SJ Oh, SY Lee, H Kim, D Kwak, C Bae, TS Kim Solid State Phenomena 314, 23-28, 2021 | 1 | 2021 |
| Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process C Bae, J Kim, D Kwak, S Oh, T Kim Applied Sciences 13 (6), 3758, 2023 | | 2023 |
| Silica Particle Removal Mechanism in Copper Buff Cleaning P Liu, J Lee, D Kwak, J Lee, H Seo, S Hong, T Kim 239th ECS Meeting with the 18th International Meeting on Chemical Sensors …, 2021 | | 2021 |
| Effect of Applied Pressure on the Ceria Chemical Mechanical Planarization D Kwak, S Oh, J Yun, J Kim, T Kim Electrochemical Society Meeting Abstracts 239, 825-825, 2021 | | 2021 |
| Investigation of 2-Way Injection Method on Cu CMP Process J Kim, C Bae, D Kwak, S Oh, T Kim Electrochemical Society Meeting Abstracts 239, 809-809, 2021 | | 2021 |
