Dr. Jason J. Keleher
Dr. Jason J. Keleher
Professor and Chair of Chemistry at Lewis University
Verified email at lewisu.edu - Homepage
Cited by
Cited by
Photo-catalytic preparation of silver-coated TiO 2 particles for antibacterial applications
J Keleher, J Bashant, N Heldt, L Johnson, Y Li
World Journal of Microbiology and Biotechnology 18 (2), 133-139, 2002
Hydroxyl Radical Formation in H 2 O 2‐Amino Acid Mixtures and Chemical Mechanical Polishing of Copper
M Hariharaputhiran, J Zhang, S Ramarajan, JJ Keleher, Y Li, SV Babu
Journal of The Electrochemical Society 147 (10), 3820, 2000
Diamond slurry for chemical-mechanical planarization of semiconductor wafers
Y Li, DB Cerutti, DJ Buckley Jr, ER Tyre Jr, JJ Keleher, RJ Uriarte, ...
US Patent 6,258,721, 2001
Silica-based slurry
SD Hellring, CP McCann, CF Kahle, Y Li, J Keleher
US Patent 6,656,241, 2003
Chemical mechanical polishing composition and method
Y Li, J Keleher, J Zhao, C Brancewicz
US Patent App. 10/292,404, 2004
Diamond slurry for chemical-mechanical planarization of semiconductor wafers
Y Li, DB Cerutti, DJ Buckley Jr, ER Tyre Jr, JJ Keleher, RJ Uriarte, ...
US Patent 6,242,351, 2001
Synthesis and characterization of a chitosan/PVA antimicrobial hydrogel nanocomposite for responsive wound management materials
SJ Rinehart, T Campbell, KJ Burke, B Garcia, A Mlynarski, SJ Brain, ...
J. Microb. Biochem. Technol 8 (02), 2016
Evaluation of the catalytic decomposition of H2O2 through use of organo-metallic complexes–A potential link to the luminol presumptive blood test
TJ Soderquist, OM Chesniak, MR Witt, A Paramo, VA Keeling, JJ Keleher
Forensic science international 219 (1-3), 101-105, 2012
Compositions and methods for CMP of low-k-dielectric materials
J Keleher, D Woodland, FDR Thesauro, R Medsker, J Aggio
US Patent 7,456,107, 2008
Method of fabricating a copper damascene structure
Y Li, J Keleher
US Patent 6,660,639, 2003
Metal-passivating CMP compositions and methods
J Keleher, P Singh, V Brusic
US Patent 8,435,421, 2013
Relationship between molecular structure and removal rates during chemical mechanical planarization: Comparison of benzotriazole and 1, 2, 4-triazole
KL Stewart, JJ Keleher, AA Gewirth
Journal of The Electrochemical Society 155 (10), D625, 2008
A biomimetic cellulose‐based composite material that incorporates the antimicrobial metal‐organic framework HKUST‐1
TA Rickhoff, E Sullivan, LK Werth, DS Kissel, JJ Keleher
Journal of Applied Polymer Science 136 (3), 46978, 2019
Slurry for chemical-mechanical polishing copper damascene structures
Y Li, J Keleher
US Patent 6,508,953, 2003
Copper CMP composition containing ionic polyelectrolyte and method
D White, JJ Keleher, J Parker
US Patent App. 11/895,896, 2009
Key chemical components in metal CMP slurries
K Cheemalapati, J Keleher, Y Li
Microelectronic Applications of Chemical Mechanical Planarization, Wiley …, 2007
Supramolecular abrasive-free system for Cu CMP
J Keleher, K Rushing, J Zhao, B Wojtczak, Y Li
MRS Online Proceedings Library 767 (1), 1-11, 2003
Bridging the gap: understanding the chemistry of CMP
J Keleher, J Zhang, S Waud, Y Li
The Chemical Educator 5 (5), 242-245, 2000
Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing
Y Li, S Hellring, J Keleher, T Zhang
US Patent App. 11/202,470, 2007
Measuring the effectiveness of photoresponsive nanocomposite coatings on aircraft windshields to mitigate laser intensity
RS Phillips, HK Bilan, ZX Widel, RJ DeMik, SJ Brain, M Moy, C Crowder, ...
Journal of Aviation Technology and Engineering 4 (2), 49, 2015
The system can't perform the operation now. Try again later.
Articles 1–20