| 3D stacked IC demonstration using a through silicon via first approach J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 182 | 2008 |
| Formation of a transition metal nitride S Armini US Patent 10,262,896, 2019 | 176 | 2019 |
| Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics M Krishtab, I Stassen, S Timothée, CA John, OO Oghuzan, ... Nature Communications 10 (3729), 2019 | 121 | 2019 |
| Composite polymer core–ceria shell abrasive particles during oxide cmp: A defectivity study S Armini, J De Messemaeker, CM Whelan, M Moinpour, K Maex Journal of the Electrochemical Society 155 (9), H653, 2008 | 117 | 2008 |
| Copper plating for 3D interconnects A Radisic, O Lühn, HGG Philipsen, Z El-Mekki, M Honore, S Rodet, ... Microelectronic Engineering 88 (5), 701-704, 2011 | 98 | 2011 |
| Integration challenges of copper through silicon via (TSV) metallization for 3D-stacked IC integration J Van Olmen, C Huyghebaert, J Coenen, J Van Aelst, E Sleeckx, ... Microelectronic Engineering 88 (5), 745-748, 2011 | 82 | 2011 |
| Composite polymer-core silica-shell abrasive particles during oxide CMP: a defectivity study S Armini, CM Whelan, K Maex, JL Hernandez, M Moinpour Journal of the electrochemical society 154 (8), H667, 2007 | 82 | 2007 |
| Prediction of scratch generation in chemical mechanical planarization A Chandra, P Karra, AF Bastawros, R Biswas, PJ Sherman, S Armini, ... CIRP annals 57 (1), 559-562, 2008 | 75 | 2008 |
| Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2‐Derived Self‐Assembled Monolayers AM Caro, S Armini, O Richard, G Maes, G Borghs, CM Whelan, Y Travaly Advanced Functional Materials 20 (7), 1125-1131, 2010 | 72 | 2010 |
| nanoscale indentation of polymer and composite polymer− silica core− shell submicrometer particles by atomic force microscopy S Armini, IU Vakarelski, CM Whelan, K Maex, K Higashitani Langmuir 23 (4), 2007-2014, 2007 | 72 | 2007 |
| Capturing wetting states in nanopatterned silicon XM Xu, G Vereecke, C Chen, G Pourtois, S Armini, N Verellen, WK Tsai, ... Acs Nano 8 (1), 885-893, 2014 | 66 | 2014 |
| Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry L Lecordier, S Herregods, S Armini Journal of Vacuum Science & Technology A 36 (3), 2018 | 63 | 2018 |
| Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias F Inoue, H Philipsen, A Radisic, S Armini, Y Civale, P Leunissen, ... Electrochimica Acta 100, 203-211, 2013 | 59 | 2013 |
| Copper CMP with composite polymer core-silica shell abrasives: A defectivity study S Armini, CM Whelan, M Moinpour, K Maex MRS Online Proceedings Library (OPL) 1079, 1079-N11-04, 2008 | 58 | 2008 |
| Selective Ru ALD as a catalyst for sub-seven-nanometer bottom-up metal interconnects I Zyulkov | 55* | |
| Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed S Armini, Z El-Mekki, K Vandersmissen, H Philipsen, S Rodet, M Honore, ... Journal of the Electrochemical Society 158 (2), H160, 2010 | 48 | 2010 |
| Composite Polymer Core–Silica Shell Abrasives: Effect of Polishing Time and Slurry Solid Content on Oxide CMP S Armini, CM Whelan, M Moinpour, K Maex Electrochemical and Solid-State Letters 10 (9), H243, 2007 | 43 | 2007 |
| Composite polymer core–silica shell abrasives: the effect of the shape of the silica particles on oxide CMP S Armini, CM Whelan, M Moinpour, K Maex Journal of the Electrochemical Society 155 (6), H401, 2008 | 42 | 2008 |
| Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments S Armini, Z El-Mekki, J Swerts, M Nagar, S Demuynck Journal of The Electrochemical Society 160 (3), D89, 2013 | 35* | 2013 |
| Electroless copper bath stability monitoring with UV-Vis spectroscopy, pH, and mixed potential measurements F Inoue, H Philipsen, A Radisic, S Armini, Y Civale, S Shingubara, ... Journal of The Electrochemical Society 159 (7), D437, 2012 | 34 | 2012 |
