| Survey of on-line control strategies of human-powered augmentation exoskeleton systems AIA Ahmed, H Cheng, X Lin, M Omer, MA Juma Hilaris, 2016 | 13 | 2016 |
| Variable admittance control for climbing stairs in human-powered exoskeleton systems AIA Ahmed, H Cheng, X Lin, M Omer, MA Juma Hilaris, 2016 | 8 | 2016 |
| Interaction force convex reduction for smooth gait transitions on human-power augmentation lower exoskeletons AIA Ahmed, H Cheng, H Liu, X Lin, MJ Atieno Cognitive Systems and Signal Processing: Third International Conference …, 2017 | 4 | 2017 |
| Hoop stress development on silicon dioxide liner in through silicon via JM Atieno, X Zhang, HS Bai 2015 IEEE Advanced Information Technology, Electronic and Automation Control …, 2015 | 1 | 2015 |
| Variations in Hoop Stresses among Silicon Dioxide, Polystyrene and Polypropylene Carbonate Through Silicon Via Liners JM Atieno, X Zhang 2015 Joint International Mechanical, Electronic and Information Technology …, 2015 | 1 | 2015 |
| Automatic low-cost water level indicator for tanks and hand washing water dispensers in Kitui; Kenya during the covid 19 pandemic M JUMA, A Ahmed, BK Kussia, S Kuya Journal of Karary University for Engineering and Science, 2022 | | 2022 |
| Coupling and synchronization of hiv/aids fisher folk metapopulations J Chepkwony, T Rotich, R Lagat, J Bitok International Journal of Applied 11 (2), 35-42, 2022 | | 2022 |
| Effects of varying the through silicon via liners thickness on their hoop stresses and deflections JM Atieno, X Zhang, HS Bai The Journal of Engineering 2017 (4), 85-90, 2017 | | 2017 |
| Effects of varying the through silicon via liners thickness on their hoop stresses and deflections MA Juma, X Zhang, HS Bai IET, 2017 | | 2017 |
| S-parameters optimization in both segmented and unsegmented insulated TSV JM Atieno, X Zhang, HS Bai 2016 International Conference on Integrated Circuits and Microsystems (ICICM …, 2016 | | 2016 |
| S-parameters optimization in both segmented and unsegmented insulated TSV MA Juma, X Zhang, HS Bai IEEE, 2016 | | 2016 |
| Optimization of deformations and hoop stresses in TSV liners to boost interconnect reliability in electronic appliances MA Juma, X Zhang, SB He, AIA Abusabah Eighth International Conference on Machine Vision (ICMV 2015) 9875, 469-473, 2015 | | 2015 |
| Variations in hoop stresses among silicon dioxide, polystyrene and polypropylene carbonate through silicon via liners MA Juma, X Zhang, HS Bai Atlantis Press, 2015 | | 2015 |
| Hoop stress development on silicon dioxide liner in through silicon via MA Juma, X Zhang, HS Bai IEEE, 2015 | | 2015 |
| Assessing the interconnect reliability, stress and deformation around via in flip chips JM Atieno, Z Xuliang Control Engineering and Electronics Engineering 95, 345, 2014 | | 2014 |
| Assessing the interconnect reliability, stress and deformation around via in flip chips MA Juma, Z Xuliang | | 2014 |
| Assessing central cracks and interconnect reliability in flipchips MA Juma, Z Xuliang | | 2014 |
| Assessing cracks and interconnect reliability in flipchips MA Juma, Z Xuliang | | 2014 |
| Assessing Cracks And Interconnect Reliability In Flipchips JM Atieno, Z Xuliang | | |
| Assessing Central Cracks and Interconnect Reliability in Flipchips JM Atieno, Z Xuliang | | |
Abusabah I. A. AhmedAssociate Professor- Karary UniversityVerified email at karary.edu.sd
