Klaus-Juergen Wolter
Klaus-Juergen Wolter
Professor für Verfahrenstechnologie der Elektronik, TU Dresden
Verified email at tu-dresden.de
Title
Cited by
Cited by
Year
Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders
S Wiese, E Meusel, KJ Wolter
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
1332003
Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders
S Wiese, KJ Wolter
Microelectronics Reliability 44 (12), 1923-1931, 2004
1272004
Creep of thermally aged SnAgCu-solder joints
S Wiese, KJ Wolter
Microelectronics Reliability 47 (2-3), 223-232, 2007
872007
Simulation-based optimization vs. mathematical programming: A hybrid approach for optimizing scheduling problems
A Klemmt, S Horn, G Weigert, KJ Wolter
Robotics and Computer-Integrated Manufacturing 25 (6), 917-925, 2009
562009
The effect of downscaling the dimensions of solder interconnects on their creep properties
S Wiese, M Roellig, M Mueller, KJ Wolter
Microelectronics Reliability 48 (6), 843-850, 2008
492008
Microelectronic joining processes with bonding material application
B Haba, KJ Wolter
US Patent 6,492,251, 2002
482002
Effect of composition and cooling rate on the microstructure of SnAgCu-solder joints
M Mueller, S Wiese, M Roellig, KJ Wolter
2007 Proceedings 57th Electronic Components and Technology Conference, 1579-1588, 2007
412007
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects
I Panchenko, K Croes, I De Wolf, J De Messemaeker, E Beyne, KJ Wolter
Microelectronic engineering 117, 26-34, 2014
402014
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel
Journal of Materials Research 26 (16), 2103, 2011
402011
A class of four-group quasi-orthogonal STBC achieving full rate and full diversity for any number of antennas
C Yuen, YL Guan, TT Tjhung
2005 IEEE 16th International Symposium on Personal, Indoor and Mobile Radio …, 2005
402005
Investigations of carbon nanotubes epoxy composites for electronics packaging
M Heimann, M Wirts-Ruetters, B Boehme, KJ Wolter
2008 58th Electronic Components and Technology Conference, 1731-1736, 2008
372008
Joining semiconductor units with bonding material
B Haba, KJ Wolter
US Patent 6,750,539, 2004
332004
Embedded passive components for MCM
LJ Golonka, KJ Wolter, A Dziedzic, J Kita, L Rebenklau
24th International Spring Seminar on Electronics Technology. Concurrent …, 2001
332001
Realization of LTCC-multilayer with special cavity applications
R Bauer, M Luniak, L Rebenklau, KJ Wolter, W Sauer
SPIE proceedings series, 659-664, 1997
321997
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
M Roellig, R Dudek, S Wiese, B Boehme, B Wunderle, KJ Wolter, ...
Microelectronics Reliability 47 (2-3), 187-195, 2007
292007
Carbon nanotube composites for electronic packaging applications: a review
L Aryasomayajula, KJ Wolter
Journal of Nanotechnology 2013, 2013
272013
Fodel microresistors––processing and basic electrical properties
A Dziedzic, L Rebenklau, LJ Golonka, KJ Wolter
Microelectronics Reliability 43 (3), 377-383, 2003
262003
Surface crack detection in ferritic and austenitic steel components using inductive heated thermography
M Noethen, KJ Wolter, N Meyendorf
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 249-254, 2010
252010
Creep measurements of 200 μm-400 μm solder joints
M Rollig, S Wiese, K Meier, KJ Wolter
2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007
242007
Creep of eutectic SnAgCu in thermally treated solder joints
S Wiese, M Roellig, KJ Wolter
Proceedings Electronic Components and Technology, 2005. ECTC'05., 1272-1281, 2005
232005
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Articles 1–20