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Evan Golden
Evan Golden
MIT, Lincoln Laboratory
Verified email at mit.edu
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Cited by
Year
Determining interface dielectric losses in superconducting coplanar-waveguide resonators
W Woods, G Calusine, A Melville, A Sevi, E Golden, DK Kim, ...
Physical Review Applied 12 (1), 014012, 2019
1202019
Advanced fabrication processes for superconductor electronics: Current status and new developments
SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, E Golden, TJ Weir, ...
IEEE Transactions on Applied Superconductivity 29 (5), 1-13, 2019
1002019
Solid-state qubits integrated with superconducting through-silicon vias
DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ...
npj Quantum Information 6 (1), 59, 2020
892020
Comparison of dielectric loss in titanium nitride and aluminum superconducting resonators
A Melville, G Calusine, W Woods, K Serniak, E Golden, BM Niedzielski, ...
Applied Physics Letters 117 (12), 2020
522020
Josephson arbitrary waveform synthesis with multilevel pulse biasing
JA Brevik, NE Flowers-Jacobs, AE Fox, EB Golden, PD Dresselhaus, ...
IEEE Transactions on Applied Superconductivity 27 (3), 1-7, 2017
362017
Inductance of superconductor integrated circuit features with sizes down to 120 nm
SK Tolpygo, EB Golden, TJ Weir, V Bolkhovsky
Superconductor Science and Technology 34 (8), 085005, 2021
332021
Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions
SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, AL Day, E Golden, TJ Weir, ...
IEEE Transactions on Applied Superconductivity 29 (5), 1-8, 2019
262019
A new family of bioSFQ logic/memory cells
VK Semenov, EB Golden, SK Tolpygo
IEEE Transactions on Applied Superconductivity 32 (4), 1-5, 2021
202021
Progress toward superconductor electronics fabrication process with planarized NbN and NbN/Nb layers
SK Tolpygo, JL Mallek, V Bolkhovsky, R Rastogi, EB Golden, TJ Weir, ...
IEEE Transactions on Applied Superconductivity 33 (5), 1-12, 2023
162023
Fabrication of superconducting through-silicon vias
JL Mallek, DRW Yost, D Rosenberg, JL Yoder, G Calusine, M Cook, ...
arXiv preprint arXiv:2103.08536, 2021
162021
Mutual and self-inductance in planarized multilayered superconductor integrated circuits: Microstrips, striplines, bends, meanders, ground plane perforations
SK Tolpygo, EB Golden, TJ Weir, V Bolkhovsky
IEEE Transactions on Applied Superconductivity 32 (5), 1-31, 2022
132022
A 150-nm process node of an eight-Nb-layer fully planarized process for superconductor electronics
SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, E Golden, TJ Weir, ...
Proceedings of the Applied Superconductivity Conference, ASC 2020 Virtual …, 2020
122020
Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf. 6
DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ...
122020
BioSFQ circuit family for neuromorphic computing: Bridging digital and analog domains of superconductor technologies
VK Semenov, EB Golden, SK Tolpygo
IEEE Transactions on Applied Superconductivity, 2023
82023
SFQ bias for SFQ digital circuits
VK Semenov, EB Golden, SK Tolpygo
IEEE Transactions on Applied Superconductivity 31 (5), 1-7, 2021
82021
A 150-nm node of an eight-Nb-layer fully planarized process for superconductor electronics
SK Tolpygo, V Bolkhovsky, R Rastogi, S Zarr, E Golden, TJ Weir, ...
presented at the Applied Superconductivity Conference, Wk1EOr3B-01, 2020
72020
Self-and mutual inductance of NbN and bilayer NbN/Nb inductors in a planarized fabrication process with Nb ground planes
SK Tolpygo, EB Golden, TJ Weir, V Bolkhovsky, R Rastogi
IEEE Transactions on Applied Superconductivity, 2023
62023
On-chip temperature distribution of Josephson voltage standard devices
AE Fox, EB Golden, PD Dresselhaus, SP Benz
IEEE Transactions on Applied Superconductivity 27 (4), 1-5, 2016
52016
Inductance and mutual inductance of superconductor integrated circuit features with sizes down to 120 nm. part I
S Tolpygo, EB Golden, TJ Weir, V Bolkhovsky
arXiv preprint arXiv:2101.07457, 2021
32021
Low-Cost Superconducting Fan-Out with Cell IC Ranking
J Volk, G Tzimpragos, A Wynn, E Golden, T Sherwood
IEEE Transactions on Applied Superconductivity, 2023
22023
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