Dr. Asit Kumar Gain
Dr. Asit Kumar Gain
School of Mechanical and Manufacturing Engineering, UNSW
ยืนยันอีเมลแล้วที่ unsw.edu.au
ชื่อ
อ้างโดย
อ้างโดย
ปี
Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
AK Gain, YC Chan, WKC Yung
Microelectronics Reliability 51 (5), 975-984, 2011
1012011
The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads
AK Gain, T Fouzder, YC Chan, A Sharif, NB Wong, WKC Yung
Journal of Alloys and Compounds 506 (1), 216-223, 2010
892010
Microstructure and mechanical properties of porous yttria stabilized zirconia ceramic using poly methyl methacrylate powder
AK Gain, HY Song, BT Lee
Scripta Materialia 54 (12), 2081-2085, 2006
892006
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
AK Gain, YC Chan, WKC Yung
Microelectronics Reliability 51 (12), 2306-2313, 2011
862011
Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads
AK Gain, T Fouzder, YC Chan, WKC Yung
Journal of Alloys and Compounds 509 (7), 3319-3325, 2011
842011
Effect of Nano Ni Additions on the Structure and Properties of Sn-9Zn and Sn-8Sn-3Bi Solder in Ball Grid Array Packages
AK Gain, YC Chan, KC Yung
Materials Science and Engineering: B 162 (2), 92-98, 2009
632009
Effect of nano Ni Additions on the Structure and Properties of Sn-9Zn and Sn-8Sn-3Bi Solder in Ball Grid Array Packages
AK Gain, YC Chan, KC Yung, A Sharif, L Ali
2nd Electronics System integration Technology Conference Greenwich, UK 2 …, 2008
63*2008
The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads
AK Gain, YC Chan
Intermetallics 29, 48-55, 2012
582012
Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite solders
AK Gain, YC Chan
Microelectronics Reliability 54 (5), 945-955, 2014
542014
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages
AK Gain, YC Chan, A Sharif, NB Wong, WKC Yung
Microelectronics Reliability 49 (7), 746-753, 2009
522009
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads
T Fouzder, AK Gain, YC Chan, A Sharif, WKC Yung
Microelectronics Reliability 50 (12), 2051-2058, 2010
432010
Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder
AK Gain, L Zhang
Journal of Materials Science: Materials in Electronics 27 (1), 781-794, 2016
422016
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy
M Ahmed, T Fouzder, A Sharif, AK Gain, YC Chan
Microelectronics Reliability 50 (8), 1134-1141, 2010
402010
Microstructure and material properties of porous hydroxyapatite-zirconia nanocomposites using polymethyl methacrylate powders
AK Gain, L Zhang, W Liu
Materials & Design 67, 136-144, 2015
392015
Fabrication of continuously porous SiC–Si3N4 composite using SiC powder by extrusion process
AK Gain, JK Han, HD Jang, BT Lee
Journal of the European Ceramic Society 26 (13), 2467-2473, 2006
382006
Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn–8Zn–3Bi solder on OSP–Cu substrate
AK Gain, L Zhang
Journal of alloys and compounds 617, 779-786, 2014
362014
Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
AK Gain, L Zhang, MZ Quadir
Materials and Design 110, 275-283, 2016
342016
Microstructure control of continuously porous t-ZrO2 bodies fabricated by multi-pass extrusion process
AK Gain, BT Lee
Materials Science and Engineering: A 419 (1-2), 269-275, 2006
342006
A review on metallic porous materials: pore formation, mechanical properties, and their applications
B Zhao, AK Gain, W Ding, L Zhang, X Li, Y Fu
The International Journal of Advanced Manufacturing Technology 95, 2641–2659, 2018
332018
Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate
AK Gain, L Zhang
Journal of Materials Science: Materials in Electronics 27, 3982–3994, 2016
292016
ระบบไม่สามารถดำเนินการได้ในขณะนี้ โปรดลองใหม่อีกครั้งในภายหลัง
บทความ 1–20