| Numerical investigation and sensitivity analysis of manifold microchannel coolers L Boteler, N Jankowski, P McCluskey, B Morgan International Journal of Heat and Mass Transfer 55 (25-26), 7698-7708, 2012 | 79 | 2012 |
| Experimental evaluation of metallic phase change materials for thermal transient mitigation D Gonzalez-Nino, LM Boteler, D Ibitayo, NR Jankowski, D Urciuoli, ... International Journal of Heat and Mass Transfer 116, 512-519, 2018 | 67 | 2018 |
| Stacked power module with integrated thermal management LM Boteler, DP Urciuoli US Patent App. 10/178,813, 2019 | 45* | 2019 |
| Stacked power module with integrated thermal management LM Boteler, VA Niemann, DP Urciuoli, SM Miner 2017 IEEE International Workshop on Integrated Power Packaging (IWIPP), 1-5, 2017 | 37 | 2017 |
| Comparing microchannel technologies to minimize the thermal stack and improve thermal performance in hybrid electric vehicles NR Jankowski, L Everhart, B Morgan, B Geil, P McCluskey 2007 IEEE Vehicle Power and Propulsion Conference, 124-130, 2007 | 37 | 2007 |
| Stereolithographically fabricated aluminum nitride microchannel substrates for integrated power electronics cooling NR Jankowski, L Everhart, BR Geil, CW Tipton, J Chaney, T Heil, ... 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 29 | 2008 |
| Manifold microchannel cooler for direct backside liquid cooling of SiC power devices L Everhart, N Jankowski, B Geil, A Bayba, D Ibitayo, P McCluskey ASME 2007 5th International Conference on Nanochannels, Microchannels, and …, 2007 | 26 | 2007 |
| Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages DG Pahinkar, W Puckett, S Graham, L Boteler, D Ibitayo, S Narumanchi, ... Advanced Engineering Materials 20 (10), 1800039, 2018 | 24 | 2018 |
| Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages SV Narumanchi, PP Paret, DJ DeVoto, J Major, DG Pahinkar, W Puckett, ... Advanced Engineering Materials 20 (NREL/JA-5400-71786), 2018 | 24* | 2018 |
| Measurement of High-Performance Thermal Interfaces Using a Reduced Scale Steady-State Tester and Infrared Microscopy AN Smith, NR Jankowski, LM Boteler Journal of Heat Transfer 138 (4), 041301, 2016 | 23 | 2016 |
| Power packaging thermal and stress model for quick parametric analyses LM Boteler, SM Miner ASME 2017 International Technical Conference and Exhibition on Packaging and …, 2017 | 18 | 2017 |
| Thermal performance of a dual 1.2 kV, 400 a silicon-carbide MOSFET power module L Boteler, D Urciuoli, G Ovrebo, D Ibitayo, R Green 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 18 | 2010 |
| Co-Designed High Voltage Module LM Boteler, SM Miner, M Hinojosa 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 16 | 2018 |
| High voltage stacked diode package with integrated thermal management LM Boteler, M Hinojosa, VA Niemann, SM Miner, D Gonzalez-Nino 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 16 | 2017 |
| Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages DG Pahinkar, L Boteler, D Ibitayo, S Narumanchi, P Paret, D DeVoto, ... Journal of Electronic Packaging 141 (4), 041001, 2019 | 14 | 2019 |
| Steady-state measurements of thermal transport across highly conductive interfaces RJ Warzoha, L Boteler, AN Smith, E Getto, BF Donovan International Journal of Heat and Mass Transfer 130, 874-881, 2019 | 13 | 2019 |
| A micromachined manifold microchannel cooler L Boteler, N Jankowski, B Geil, P McCluskey ASME 2009 International Mechanical Engineering Congress and Exposition, 61-68, 2009 | 13 | 2009 |
| Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool LM Boteler, SM Miner ASME 2018 International Technical Conference and Exhibition on Packaging and …, 2018 | 11 | 2018 |
| 3D Thermal Resistance Network Method for the Design of Highly Integrated Packages L Boteler, A Smith ASME 2013 Heat Transfer Summer Conference collocated with the ASME 2013 7th …, 2013 | 11 | 2013 |
| Integrated Vapor Chamber Heat Spreader for Power Module Applications CL Hose, D Ibitayo, LM Boteler, J Weyant, B Richard ASME 2017 International Technical Conference and Exhibition on Packaging and …, 2017 | 10 | 2017 |
