Maria Mirgkizoudi
Maria Mirgkizoudi
Verified email at lboro.ac.uk - Homepage
Title
Cited by
Cited by
Year
Reliability testing of electronic packages in harsh environments
M Mirgkizoudi, C Liu, S Riches
2010 12th Electronics Packaging Technology Conference, 224-230, 2010
132010
Combined temperature and vibration testing for wire bond interconnections in harsh environment electronics
M Mirgkizoudi, C Liu, PP Conway, S Riches
Journal of microelectronics and electronic packaging 10 (2), 80-88, 2013
72013
Effects of combined thermal and vibration loadings on the wire bond integrity
KA Kamaludin, M Mirgkizoudi, C Liu, S Riches
2011 12th International Conference on Electronic Packaging Technology and …, 2011
52011
Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
M Mirgkizoudi, C Liu, P Conway, S Riches
Additional Papers and Presentations 2013 (HITEN), 000220-000228, 2013
42013
Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions
M Mirgkizoudi, C Liu, PP Conway, S Riches
Microelectronics Reliability 55 (6), 952-960, 2015
32015
Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads
R Man, C Liu, M Mirgkizoudi, S Riches
Additional Papers and Presentations 2014 (HITEC), 000263-000270, 2014
32014
Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates
J Hinton, M Mirgkizoudi, A Campos-Zatarain, D Flynn, RA Harris, RW Kay
2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018
12018
Mechanical and interfacial characteristics of Zn-Al solder joints under elevated temperature and vibration conditions
L Liu, M Mirgkizoudi, P Zhang, L Zhou, C Liu
Proceedings of the 5th Electronics System-integration Technology Conference …, 2014
12014
Characterization of Cu-Sn SLID interconnects for harsh environment applications
A Campos-Zatarain, D Flynn, KE Aasmundtveit, N Hoivik, K Wang, H Liu, ...
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2014
12014
Hybrid additive manufacturing of precision engineered ceramic components
J Hinton, D Basu, M Mirgkizoudi, D Flynn, R Harris, R Kay
Rapid Prototyping Journal, 2019
2019
Extreme environment interconnects and packaging for power electronics
A Campos-Zatarain, J Hinton, M Mirgkizoudi, J Li, R Harris, RW Kay, ...
The Journal of Engineering 2019 (17), 4226-4230, 2019
2019
Extreme Environment Interconnects and Packaging for Power Electronics
D Flynn, AC Zatarain, RW Kay, RA Harris, M Mirgkizoudi
9th International Conference on Power Electronics, Machines and Drives 2018, 2018
2018
2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2018-PROCEEDINGS
J Meyer, PJ Upasani, S Bickel, I Panchenko, WM Jurgen, O Krammer, ...
2018
Evaluation of High Temperature Joining Technologies for Semiconductor Die Attach
S Qi, C Powley, M Mirgkizoudi, A Pliscott, P Collier
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2017 (HiTen …, 2017
2017
Performance of wire-bonded interconnects under combined thermal and vibration loads
M Mirgkizoudi
Loughborough University, 2015
2015
Effects of Combined Harsh Conditions on Wire Bond Reliability
M Mirgkizoudi, C Liu, P Conway, S Riches
AIP Conference Proceedings, 2012
2012
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Articles 1–16