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Yong Zhang
Yong Zhang
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Year
Functionalization mediates heat transport in graphene nanoflakes
H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ...
Nature Communications 7 (1), 1-9, 2016
1352016
Improved heat spreading performance of functionalized graphene in microelectronic device application
Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ...
Advanced Functional Materials 25 (28), 4430-4435, 2015
1172015
Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Z Gao, Y Zhang, Y Fu, MMF Yuen, J Liu
Carbon 61, 342-348, 2013
1082013
Stable, glassy, and versatile binaphthalene derivatives capable of efficient hole transport, hosting, and deep‐blue light emission
B Wei, JZ Liu, Y Zhang, JH Zhang, HN Peng, HL Fan, YB He, XC Gao
Advanced Functional Materials 20 (15), 2448-2458, 2010
802010
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ...
Journal of Physics D: Applied Physics 49 (26), 265501, 2016
442016
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ...
Carbon 106, 195-201, 2016
302016
Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
X Luo, Y Zhang, C Zandén, M Murugesan, Y Cao, L Ye, J Liu
Journal of Materials Science: Materials in Electronics 25 (5), 2333-2338, 2014
302014
Enhanced electrochemical performance of three-dimensional graphene/carbon nanotube composite for supercapacitor application
Z Niu, Y Zhang, Y Zhang, X Lu, J Liu
Journal of Alloys and Compounds 820, 153114, 2020
292020
Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications
W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu
Journal of Electronic Materials 44 (8), 2898-2907, 2015
192015
Graphene heat spreader for thermal management of hot spots in electronic packaging
Z Gao, Y Zhang, Y Fu, M Yuen, J Liu
18th International Workshop on THERMal INvestigation of ICs and Systems, 1-4, 2012
182012
Chemical vapor deposition grown graphene on Cu-Pt alloys
Y Zhang, Y Fu, M Edwards, K Jeppson, L Ye, J Liu
Materials Letters 193, 255-258, 2017
152017
Properties of undoped few-layer graphene-based transparent heaters
Y Zhang, H Liu, L Tan, Y Zhang, K Jeppson, B Wei, J Liu
Materials 13 (1), 104, 2019
122019
Graphene heat spreader for thermal management of hot spots
Z Gao, Y Zhang, Y Fu, M Yuen, J Liu
2013 IEEE 63rd Electronic Components and Technology Conference, 2075-2078, 2013
112013
Cooling hot spots by hexagonal boron nitride heat spreaders
S Sun, J Bao, W Mu, Y Fu, Y Zhang, L Ye, J Liu
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1658-1663, 2015
102015
Characterization for graphene as heat spreader using thermal imaging method
S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu
2013 14th International Conference on Electronic Packaging Technology, 403-408, 2013
102013
Graphene based heat spreader for high power chip cooling using flip-chip technology
S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 347-352, 2013
82013
Use of graphene-based films for hot spot cooling
Y Zhang, P Zhang, N Wang, Y Fu, J Liu
Proceedings of the 5th Electronics System-integration Technology Conference …, 2014
62014
2D heat dissipation materials for microelectronics cooling applications
Y Zhang, S Huang, N Wang, J Bao, S Sun, M Edwards, X Fu, W Yue, X Lu, ...
2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016
42016
Reliability of graphene-based films used for high power electronics packaging
S Huang, Y Zhang, N Wang, N Wang, Y Fu, L Ye, J Liu
2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015
42015
Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition
Y Zhang, MK Samani, J Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 139-142, 2017
12017
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