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Jihperng (Jim) Leu
Jihperng (Jim) Leu
Professor Emeritus of Materials Science and Engineering, National Chiao Tung University
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Titel
Zitiert von
Zitiert von
Jahr
Method of making semiconductor device using an interconnect
J Leu, CD Thomas
US Patent 6,605,874, 2003
3502003
Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics
J Leu, CI Wu, Y Zhou, GM Kloster
US Patent 6,605,549, 2003
2622003
Overview on low dielectric constant materials for IC applications
PS Ho, J Leu, WW Lee
Low Dielectric Constant Materials for IC Applications, 1-21, 2003
1632003
Electromagnetically actuated micromachined flap
CM Ho, DK Miu, JTS Leu, R Miller, A Desai, C Liu, T Tsao, YC Tai
US Patent 5,629,918, 1997
1521997
Low-K dielectric structure and method
GM Kloster, X Morrow, J Leu
US Patent 7,294,934, 2007
1412007
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide
MD Goodner, J Leu
US Patent 6,924,222, 2005
1072005
Fracture of metal‐polymer line structures. I. Semiflexible polyimide
SL Chiu, J Leu, PS Ho
Journal of Applied Physics 76 (9), 5136-5142, 1994
961994
Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements
D Gan, PS Ho, R Huang, J Leu, J Maiz, T Scherban
Journal of Applied Physics 97 (10), 2005
912005
Method for making a dual damascene interconnect using a multilayer hard mask
P Morrow, J Leu, CH Jan
US Patent 6,479,391, 2002
912002
Thermoelectric properties of nanostructured bismuth–telluride thin films grown using pulsed laser deposition
PH Le, CN Liao, CW Luo, J Leu
Journal of alloys and compounds 615, 546-552, 2014
902014
Growth and characterization of topological insulator Bi2Se3 thin films on SrTiO3 using pulsed laser deposition
PH Le, KH Wu, CW Luo, J Leu
Thin Solid Films 534, 659-665, 2013
862013
Materials Issues and Characterization of Low-k Dielectric Materials
ET Ryan, AJ McKerrow, J Leu, PS Ho
Mrs Bulletin 22 (10), 49-54, 1997
801997
Method of forming a selectively converted inter-layer dielectric using a porogen material
GM Kloster, KP O'brien, MD Goodner, J Leu, DH Gracias, LD Rockford, ...
US Patent 7,018,918, 2006
792006
Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer
G Kloster, J Leu, L Wong, A Ott, P Marrow
US Patent 7,164,206, 2007
762007
Small angle x-ray scattering measurements of lithographic patterns with sidewall roughness from vertical standing waves
C Wang, RL Jones, EK Lin, WL Wu, J Leu
Applied Physics Letters 90 (19), 2007
722007
Dye-sensitized solar cells based on agarose gel electrolytes using allylimidazolium iodides and environmentally benign solvents
HL Hsu, CF Tien, YT Yang, J Leu
Electrochimica Acta 91, 208-213, 2013
682013
Fabrication and CO sensing properties of mesostructured ZnO gas sensors
CY Liu, CF Chen, JP Leu
Journal of The Electrochemical Society 156 (1), J16, 2008
622008
Out-of-plane magnetic actuators with electroplated permalloy for fluid dynamics control
C Liu, T Tsao, GB Lee, JTS Leu, WY Yong, YC Tai, CM Ho
Sensors and Actuators A: physical 78 (2-3), 190-197, 1999
611999
Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material
G Kloster, J Leu, HM Park
US Patent 6,867,125, 2005
602005
Effect of moisture on electrical properties and reliability of low dielectric constant materials
YL Cheng, KW Leon, JF Huang, WY Chang, YM Chang, J Leu
Microelectronic Engineering 114, 12-16, 2014
582014
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