| Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation E Kim, J Hong, S Hong, C Kanade, H Seok, HU Kim, T Kim Materials Chemistry and Physics 273, 124967, 2021 | 33 | 2021 |
| Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process C Shin, H Qin, S Hong, S Jeon, A Kulkarni, T Kim Journal of Mechanical Science and Technology 30, 5659-5665, 2016 | 18 | 2016 |
| A water polishing process to improve ceria abrasive removal S Hong, J Kim, J Won, N Qureshi, S Chae, Y Wada, H Hiyama, S Hamada, ... ECS Journal of Solid State Science and Technology 8 (8), P430, 2019 | 15 | 2019 |
| Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process H Kim, S Hong, C Shin, Y Jin, DH Lim, J Kim, H Hwang, T Kim Wear 392, 93-98, 2017 | 14 | 2017 |
| Investigation of thermal effects in copper chemical mechanical polishing P Liu, S Bae, S Hong, C Bae, H Seo, J Lee, C Tang, T Kim Precision Engineering 73, 195-202, 2022 | 12 | 2022 |
| Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization S Jeon, J Hong, S Hong, C Kanade, K Park, H Seok, H Kim, S Lee, T Kim Materials Science in Semiconductor Processing 128, 105755, 2021 | 10 | 2021 |
| Effect of viscosity on ceria abrasive removal during the buff clean process J Kim, S Hong, E Kim, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... ECS Journal of Solid State Science and Technology 9 (8), 084003, 2020 | 10 | 2020 |
| Communication—effect of hydrogen water on ceria abrasive removal in post-CMP cleaning S Hong, SH Park, C Kanade, J Lee, P Liu, I Lee, H Seok, T Kim ECS Journal of Solid State Science and Technology 9 (4), 044012, 2020 | 9 | 2020 |
| Investigation of copper oxide ring formation during post chemical mechanical polishing cleaning of Cu interconnect H Kim, S Hong, Y Jin, DH Lim, J Kim, H Hwang, T Kim ECS Journal of Solid State Science and Technology 6 (8), P542, 2017 | 9 | 2017 |
| Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization S Jeon, J Lee, S Hong, H Seo, Y Cho, P Liu, K Park, T Kim Materials Science in Semiconductor Processing 138, 106280, 2022 | 8 | 2022 |
| The mechanical effect of soft pad on copper chemical mechanical polishing P Liu, Y Nam, S Lee, E Kim, S Jeon, K Park, S Hong, T Kim Materials Science in Semiconductor Processing 155, 107256, 2023 | 6 | 2023 |
| A numerical study on slurry flow with CMP pad grooves S Hong, S Bae, S Choi, P Liu, H Kim, T Kim Microelectronic Engineering 234, 111437, 2020 | 6 | 2020 |
| Investigation of a Standard Particle Deposition System on Wafer Surface and Its Application to Wafer Cleaning Y Cho, S Hong, S Lee, J Yang, SK Chae, T Kim ECS Journal of Solid State Science and Technology 8 (12), P768, 2019 | 6 | 2019 |
| Simulation and experimental investigation of the radial groove effect on slurry flow in oxide chemical mechanical polishing Y Cho, P Liu, S Jeon, J Lee, S Bae, S Hong, YH Kim, T Kim Applied Sciences 12 (9), 4339, 2022 | 5 | 2022 |
| Effect of Copper Foil Crystal Orientation on Graphene Quality Synthesized by Chemical Vapor Deposition Y Jin, HU Kim, S Hong, C Shin, A Kulkarni, T Kim Journal of Nanoscience and Nanotechnology 19 (9), 5942-5948, 2019 | 4 | 2019 |
| Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning J Lee, H Seo, SH Park, E Kim, J Lee, P Liu, S Jeon, S Hong, T Kim Materials Science in Semiconductor Processing 145, 106618, 2022 | 3 | 2022 |
| Investigations on the mechanism of silica particle removal during the Cu buff cleaning process P Liu, S Hong, S Jeon, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... Colloids and Surfaces A: Physicochemical and Engineering Aspects 627, 127156, 2021 | 3 | 2021 |
| Study on Abnormally Accelerated Oxidation of Tungsten Plugs during Tungsten Chemical Mechanical Polishing in Semiconductor Manufacturing K Hwang, Y Jeon, S Hong, P Liu, T Kim ECS Journal of Solid State Science and Technology 10 (6), 064012, 2021 | 3 | 2021 |
| Communication—A Novel Method to Improve Cleaning Performance by Removing Small Particles in CMP Slurry J Lee, SH Park, S Hong, H Seo, P Liu, E Kim, T Kim ECS Journal of Solid State Science and Technology 10 (2), 024001, 2021 | 2 | 2021 |
| Investigation of step structure in CMP retainer ring to improve within-wafer non-uniformity J Park, S Hong, S Lee, Y Jin, T Kim Journal of Mechanical Science and Technology 33, 3391-3395, 2019 | 2 | 2019 |
Taesung KimSungkyunkwan UniversityVerified email at skku.edu
