| Fundamentals of lead-free solder interconnect technology TK Lee, TR Bieler, C Kim, H Ma Springer (US) chapter 1, 1-20, 2015 | 144 | 2015 |
| Positioning of nanoparticles and fabrication of single election devices SJ Koh, CU Kim, LC Ma, R Subramanian US Patent 7,465,953, 2008 | 139 | 2008 |
| CMOS-compatible fabrication of room-temperature single-electron devices V Ray, R Subramanian, P Bhadrachalam, LC Ma, CU Kim, SJ Koh Nature nanotechnology 3 (10), 603-608, 2008 | 123 | 2008 |
| Electrostatic funneling for precise nanoparticle placement: a route to wafer-scale integration LC Ma, R Subramanian, HW Huang, V Ray, CU Kim, SJ Koh Nano letters 7 (2), 439-445, 2007 | 114 | 2007 |
| The influence of Cu precipitation on electromigration failure in Al‐Cu‐Si C Kim, JW Morris Jr Journal of applied physics 72 (5), 1837-1845, 1992 | 68 | 1992 |
| The mechanism of electromigration failure of narrow Al‐2Cu‐1Si thin‐film interconnects C Kim, JW Morris Jr Journal of applied physics 73 (10), 4885-4893, 1993 | 55 | 1993 |
| Thermal joint and method of use CU Kim, SM You US Patent 6,343,647, 2002 | 48 | 2002 |
| Investigation of the phase equilibria in the Sn-Bi-In alloy system SW Yoon, BS Rho, HM Lee, CU Kim, BJ Lee Metallurgical and materials transactions A 30, 1503-1515, 1999 | 45 | 1999 |
| Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization JY Park, CW Yang, JS Ha, CU Kim, EJ Kwon, SB Jung, CS Kang Journal of electronic materials 30, 1165-1170, 2001 | 44 | 2001 |
| Mechanism of reliability failure in Cu interconnects with ultralow-κ materials NL Michael, CU Kim, P Gillespie, R Augur Applied physics letters 83 (10), 1959-1961, 2003 | 39 | 2003 |
| Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8 Ag-0.7 Cu Pb-free solder alloy JY Park, R Kabade, CU Kim, T Carper, S Dunford, V Puligandla Journal of electronic materials 32, 1474-1482, 2003 | 37 | 2003 |
| Electromigration in Cu thin films with Sn and Al cross strips NL Michael, CU Kim Journal of Applied Physics 90 (9), 4370-4376, 2001 | 30 | 2001 |
| Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects TK Lee, CU Kim, TR Bieler Journal of electronic materials 43, 69-79, 2014 | 29 | 2014 |
| Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8 Ag-0.7 Cu alloys JY Park, CU Kim, T Carper, V Puligandla Journal of electronic materials 32, 1297-1302, 2003 | 29 | 2003 |
| Characterization of solder joint reliability using cyclic mechanical fatigue testing CU Kim, WH Bang, H Xu, TK Lee JOM 65, 1362-1373, 2013 | 28 | 2013 |
| Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films DR Frear, JR Michael, C Kim, AD Romig Jr, JW Morris Jr Metallization: Performance and Reliability Issues for VLSI and ULSI 1596, 72-82, 1991 | 27 | 1991 |
| Photocatalytic and photoluminescence properties of ZnO/graphene quasi core-shell nanoparticles SSP Haghshenas, A Nemati, R Simchi, CU Kim Ceramics International 45 (7), 8945-8961, 2019 | 26 | 2019 |
| Electromigration failure in ultra-fine copper interconnects NL Michael, CU Kim, P Gillespie, R Augur Journal of electronic materials 32, 988-993, 2003 | 25 | 2003 |
| Mechanism of electromigration failure in submicron Cu interconnects NL Michael, CU Kim, QT Jiang, RA Augur, P Gillespie Journal of electronic materials 31, 1004-1008, 2002 | 25 | 2002 |
| The metallurgical control of electromigration failure in narrow conducting lines JW Morris, CU Kim, SH Kang JOM 48, 43-46, 1996 | 25 | 1996 |
