| New quality cost models to optimize inspection strategies M Oppermann, W Sauer, H Wohlrabe, T Zerna IEEE transactions on electronics packaging manufacturing 26 (4), 328-337, 2003 | 22 | 2003 |
| X-ray computed tomography on miniaturized solder joints for nano packaging M Oppermann, T Zerna, KJ Wolter 2009 11th Electronics Packaging Technology Conference, 70-75, 2009 | 17 | 2009 |
| Packaging technologies for (Ultra-) thin sensor applications in active magnetic bearings D Ernst, M Melzer, D Makarov, F Bahr, W Hofmann, OG Schmidt, T Zerna Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 14 | 2014 |
| Electronics process technology: Production modelling, simulation and optimisation W Sauer, M Oppermann, G Weigert, S Werner, H Wohlrabe, KJ Wolter, ... Springer Science & Business Media, 2007 | 14 | 2007 |
| Optimization of inspection strategies by use of quality cost models M Oppermann, W Sauer, H Wohlrabe, T Zerna 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001 | 14 | 2001 |
| Packaging of Ultrathin Flexible Magnetic Field Sensors With Polyimide Interposer and Integration in an Active Magnetic Bearing D Ernst, M Faghih, R Liebfried, M Melzer, D Karnaushenko, W Hofmann, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 9 | 2019 |
| Process-dependent microstructure changes in solid-liquid interdiffusion interconnects for 3D integration I Panchenko Detert, M, 2014 | 9 | 2014 |
| In-Situ-X-Ray investigation on pressure release during conventional and diffusion soldering A Klemm, P Jähngen, M Oppermann, T Zerna Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 821-826, 2013 | 9 | 2013 |
| Simulation of manufacturing processes W Sauer, M Oppermann, S Werner, H Wohlrabe, T Zerna, G Weigert, ... Electronics Process Technology: Production Modelling, Simulation and …, 2006 | 9 | 2006 |
| Influence of plasma treatment on the improvement of surface energy [packaging] A Paproth, KJ Wolter, T Herzog, T Zerna 24th International Spring Seminar on Electronics Technology. Concurrent …, 2001 | 9 | 2001 |
| Analysis of soldering processes using in-situ X-Ray observations A Klemm, M Oppermann, T Zerna 2015 European Microelectronics Packaging Conference (EMPC), 1-6, 2015 | 8 | 2015 |
| Influences of organic materials on packaging technologies and their consideration for lifetime evaluation D Ernst, T Zerna, KJ Wolter Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 8 | 2011 |
| X-ray computed tomography for nano packaging-a progressive NDE method M Oppermann, T Zerna, KJ Wolter 2010 12th Electronics Packaging Technology Conference, 853-858, 2010 | 7 | 2010 |
| Thermographic inspection method for quality assessment of power semiconductors in the manufacture of power electronics modules M Schaulin, M Oppermann, T Zerna 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-7, 2018 | 6 | 2018 |
| Direct conversion X-ray detector with radiation protection for electronics T Lohse, P Krueger, M Oppermann, T Zerna, O Albrecht, R Metasch, ... US Patent 8,963,098, 2015 | 6 | 2015 |
| Absorption and diffusion of water in printed circuit boards H Zecha, C Früh, R Ratchev, E Biehl, T Zerna Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | 6 | 2013 |
| Zerstörungsfreie Prüfung elektronischer Baugruppen mittels bildgebender Verfahren KJ Wolter, M Bieberle, H Budzier, G Gerlach, T Zerna Detert, 2012 | 6 | 2012 |
| Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations A Syed-Khaja, A Klemm, T Zerna, J Franke 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1228-1234, 2016 | 5 | 2016 |
| Beiträge zur Charakterisierung des Verformungsverhaltens von bleifreien Lotwerkstoffen unter dynamischen Beanspruchungen: System Integration in Electronic Packaging K Meier Detert, M, 2015 | 5 | 2015 |
| In-Situ-X-Ray investigation on vacuum soldering processes for conventional and diffusion soldering A Klemm, M Oppermann, T Zerna Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 5 | 2014 |
