Sourav Das
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Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3D Small-world Network-on-Chip
S Das, JR Doppa, PP Pande, K Chakrabarty
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017
Optimizing 3D NoC design for energy efficiency: A machine learning approach
S Das, JR Doppa, DH Kim, PP Pande, K Chakrabarty
2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 705-712, 2015
Monolithic 3D-enabled High Performance and Energy Efficient Network-on-Chip
S Das, JR Doppa, PP Pande, K Chakravarty
35th IEEE International Conference on Computer Design, 2017, 233-240, 2017
Performance and Thermal Trade-Offs for Energy Efficient Monolithic 3D Network-on-Chip
D Lee, S Das, JR Doppa, PP Pande, K Chakrabarty
To appear in ACM Transaction on Design and Automation of Electronic System …, 2018
Automated detection of optic disc and blood vessel in retinal image using morphological, edge detection and feature extraction technique
NC Mithun, S Das, SA Fattah
International Conference Computer and Information Technology (ICCIT), 98-102, 2014
Small-world network enabled energy efficient and robust 3D NoC architectures
S Das, D Lee, DH Kim, PP Pande
Proceedings of the 25th edition on Great Lakes Symposium on VLSI, 133-138, 2015
Energy-Efficient and Reliable 3D Network-on-Chip (NoC): Architectures and Optimization Algorithms
S Das, JR Doppa, PP Pande, K Chakrabarty
Computer-Aided Design (ICCAD), 2016 IEEE/ACM International Conference on, 1-6, 2016
Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC
S Gopal, S Das, D Heo, PP Pande
To appear on 11th International Symposium on Networks-on-Chip (NOCS), 2017, 2017
Avoiding energy holes in wireless sensor networks with nonuniform node distributionIEEE
X Wu, G Chen, SK Das
Transactions on Parallel and Distributed Systems2008195710 720, 0
Impact of electrostatic coupling on monolithic 3D-enabled network on chip
D Lee, S Das, JR Doppa, PP Pande, K Chakrabarty
ACM Transactions on Design Automation of Electronic Systems (TODAES) 24 (6 …, 2019
Reliability and performance trade-offs for 3D NoC-enabled multicore chips
S Das, JR Doppa, PP Pande, K Chakrabarty
2016 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2016
High-Performance and Small-Form Factor Near Field Inductive Coupling for 3D NoC
S Gopal, S Das, P Agarwal, SN Ali, D Heo, PP Pande
IEEE Transactions on Very Large Scale Integration (VLSI) Systems., 2018
Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architecture
D Lee, S Das, PP Pande
INTEGRATION the VLSI journal, 2018
Abetting Planned Obsolescence by Aging 3D Networks-on-Chip
S Das, K Basu, JR Doppa, PP Pande, R Karri, K Chakrabarty
To appear in Proceedings of IEEE/ACM International Symposium on Networks-on …, 2018
Robust TSV-based 3D NoC Design to Counteract Electromigration and Crosstalk Noise
S Das, JR Doppa, PP Pande, K Chakrabarty
Proceedings of Design, Automation and Test in Europe (DATE), 2017, 2017
Pervasive Information Community Organization (PICO) of camileuns and delegents for future global networking
M Kumar, SK Das, B Shirazi, D Levine, J Marquis, L Welch
LSN Workshop, Vienna, USA, 2001
Interesting pattern mining using item influence
S Datta, K Mali, S Ghosh, R Singh, S Das
Advances in Decision Sciences, Image Processing, Security and Computer …, 2020
Energy-Efficient and Robust 3D NoCs with Contactless Vertical Links
S Das, S Gopal, D Heo, PP Pande
International Conference On Computer Aided Design, 2017, 2017
Smart Environments
GM Youngblood, IDC Middleware, S Das
Ch 5, 101-127, 2004
A Hybrid 3D Interconnect with 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC
S Gopal, S Das, PP Pande, D Heo
IEEE Symposium on Integrated Circuits and Systems, 2020
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