| Innovations in terahertz interconnects: High-speed data transport over fully electrical terahertz waveguide links JW Holloway, GC Dogiamis, R Han IEEE microwave magazine 21 (1), 35-50, 2019 | 44 | 2019 |
| 220-to-330-GHz manifold triplexer with wide stopband utilizing ridged substrate integrated waveguides JW Holloway, GC Dogiamis, S Shin, R Han IEEE Transactions on Microwave Theory and Techniques 68 (8), 3428-3438, 2020 | 34 | 2020 |
| Convolution inference via synchronization of a coupled CMOS oscillator array DE Nikonov, P Kurahashi, JS Ayers, H Li, T Kamgaing, GC Dogiamis, ... IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 6 …, 2020 | 22 | 2020 |
| A low-power FSK/spatial modulation transmitter for mm-wave wireless links K Zhan, J Kang, G Wang, T Kamgaing, R Khanna, G Dogiamis, H Liu, ... 2017 IEEE MTT-S International Microwave Symposium (IMS), 801-804, 2017 | 11 | 2017 |
| Investigations on an ultra-thin bendable monolithic Si CMOS image sensor GC Dogiamis, BJ Hosticka, A Grabmaier IEEE Sensors Journal 13 (10), 3892-3900, 2013 | 10 | 2013 |
| CMOS transistors under uniaxial stress on ultra-thin chips for applications in bendable image sensors J Häfner, W Mokwa, G Dogiamis, B Hosticka, A Grabmaier PRIME 2012; 8th Conference on Ph. D. Research in Microelectronics …, 2012 | 6 | 2012 |
| An ultra-thin bendable Si-monolithic imaging test sensor GC Dogiamis, J Haefner, W Mokwa, BJ Hosticka, A Grabmaier 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 4 | 2013 |
| A Low-Power FSK/Spatial Modulation Receiver for Short-Range mm-Wave Wireless Links K Zhan, Y Liu, T Kamgaing, R Khanna, G Dogiamis, H Liu, A Natarajan 2019 IEEE MTT-S International Microwave Symposium (IMS), 492-495, 2019 | 3 | 2019 |
| Theoretical considerations of the influence of mechanical uniaxial stress on pixel readout circuits GC Dogiamis, BJ Hosticka, A Grabmaier International Journal of Electronics and Communication Engineering 6 (6 …, 2012 | 3 | 2012 |
| Sensors and haptics technologies for user interface design in wearables R Baskaran, GC Dogiamis 2016 IEEE International Electron Devices Meeting (IEDM), 18.7. 1-18.7. 4, 2016 | 1 | 2016 |
| Photodiodes and Image Sensors on Mechanically Flexible Ultra-Thin Silicon Chips-in-Foil G Dogiamis Duisburg, Essen, Universität Duisburg-Essen, Diss., 2014, 2014 | 1 | 2014 |
| A novel technology for creating sensors and actuators in processor packages F Eid, Q Ma, S Oster, G Dogiamis, T Sounart, J Swan 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 925-931, 2017 | | 2017 |
| An Ultra-Thin Flexible Monolithic CMOS Imaging Test Structure for Applications in Bendable Image Sensors GC Dogiamis FLEX 2013 - IDTechEx, 2013 | | 2013 |
Spyros G.TzafestasProfessor em.of School of EC Engineering,National Technical University ofVerified email at cs.ntua.gr
