Heiko Reith
Heiko Reith
Leibniz Institute for Solid State and Materials Research
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Zitiert von
Zitiert von
Improved thermoelectric performance of n-type half-Heusler MCo1-xNixSb (M= Hf, Zr)
R He, H Zhu, J Sun, J Mao, H Reith, S Chen, G Schierning, K Nielsch, ...
Materials Today Physics 1, 24-30, 2017
The experimental investigation of thermal conductivity and the Wiedemann–Franz law for single metallic nanowires
F Völklein, H Reith, TW Cornelius, M Rauber, R Neumann
Nanotechnology 20 (32), 325706, 2009
Towards tellurium-free thermoelectric modules for power generation from low-grade heat
P Ying, R He, J Mao, Q Zhang, H Reith, J Sui, Z Ren, K Nielsch, ...
Nature communications 12 (1), 1121, 2021
A tunable strain sensor using nanogranular metals
CH Schwalb, C Grimm, M Baranowski, R Sachser, F Porrati, H Reith, ...
Sensors 10 (11), 9847-9856, 2010
Micro-thermoelectric devices
Q Zhang, K Deng, L Wilkens, H Reith, K Nielsch
Nature Electronics 5 (6), 333-347, 2022
Integrated microthermoelectric coolers with rapid response time and high device reliability
G Li, J Garcia Fernandez, DA Lara Ramos, V Barati, N Perez, I Soldatov, ...
Nature Electronics 1 (10), 555-561, 2018
Synergetic Enhancement of Thermoelectric Performance by Selective Charge Anderson Localization–Delocalization Transition in n-Type Bi-Doped PbTe/Ag2Te …
MH Lee, JH Yun, G Kim, JE Lee, SD Park, H Reith, G Schierning, ...
ACS nano 13 (4), 3806-3815, 2019
Advanced platform for the in-plane ZT measurement of thin films
V Linseis, F Völklein, H Reith, K Nielsch, P Woias
Review of Scientific Instruments 89 (1), 2018
Measuring methods for the investigation of in‐plane and cross‐plane thermal conductivity of thin films
F Völklein, H Reith, A Meier
physica status solidi (a) 210 (1), 106-118, 2013
A robust thermoelectric module based on MgAgSb/Mg 3 (Sb, Bi) 2 with a conversion efficiency of 8.5% and a maximum cooling of 72 K
P Ying, L Wilkens, H Reith, NP Rodriguez, X Hong, Q Lu, C Hess, ...
Energy & Environmental Science 15 (6), 2557-2566, 2022
Catalytic purification of directly written nanostructured Pt microelectrodes
R Sachser, H Reith, D Huzel, M Winhold, M Huth
ACS applied materials & interfaces 6 (18), 15868-15874, 2014
Berry phase and band structure analysis of the Weyl semimetal NbP
P Sergelius, J Gooth, S Bäßler, R Zierold, C Wiegand, A Niemann, ...
Scientific reports 6 (1), 33859, 2016
Platform for in-plane ZT measurement and Hall coefficient determination of thin films in a temperature range from 120 K up to 450 K
V Linseis, F Völklein, H Reith, P Woias, K Nielsch
Journal of Materials Research 31, 3196-3204, 2016
Doping High‐Mobility Donor–Acceptor Copolymer Semiconductors with an Organic Salt for High‐Performance Thermoelectric Materials
J Guo, G Li, H Reith, L Jiang, M Wang, Y Li, X Wang, Z Zeng, H Zhao, ...
Advanced Electronic Materials 6 (3), 1900945, 2020
Mg 3 (Bi, Sb) 2-based thermoelectric modules for efficient and reliable waste-heat utilization up to 750 K
Y Fu, Q Zhang, Z Hu, M Jiang, A Huang, X Ai, S Wan, H Reith, L Wang, ...
Energy & Environmental Science 15 (8), 3265-3274, 2022
Transparent Power‐Generating Windows Based on Solar‐Thermal‐Electric Conversion
Q Zhang, A Huang, X Ai, J Liao, Q Song, H Reith, X Cao, Y Fang, ...
Advanced energy materials 11 (30), 2101213, 2021
The surface-to-volume ratio: A key parameter in the thermoelectric transport of topological insulator Bi 2 Se 3 nanowires
HS Shin, B Hamdou, H Reith, H Osterhage, J Gooth, C Damm, ...
Nanoscale 8 (28), 13552-13557, 2016
Intra-wire coupling in segmented Ni/Cu nanowires deposited by electrodeposition
P Sergelius, JH Lee, O Fruchart, MS Salem, S Allende, RA Escobar, ...
Nanotechnology 28 (6), 065709, 2017
Microchips for the investigation of thermal and electrical properties of individual nanowires
F Völklein, H Reith, MC Schmitt, M Huth, M Rauber, R Neumann
Journal of electronic materials 39, 1950-1956, 2010
Fabrication and thermoelectrical characterization of three‐dimensional nanowire networks
MFP Wagner, F Völklein, H Reith, C Trautmann, ME Toimil‐Molares
physica status solidi (a) 213 (3), 610-619, 2016
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