| A 28GHz 41%-PAE linear CMOS power amplifier using a transformer-based AM-PM distortion-correction technique for 5G phased arrays SN Ali, P Agarwal, J Baylon, S Gopal, L Renaud, D Heo 2018 IEEE International Solid - State Circuits Conference - (ISSCC), San …, 2018 | 100 | 2018 |
| A 25–35 GHz neutralized continuous class-F CMOS power amplifier for 5G mobile communications achieving 26% modulation PAE at 1.5 Gb/s and 46.4% peak PAE SN Ali, P Agarwal, S Gopal, S Mirabbasi, D Heo IEEE Transactions on Circuits and Systems I: Regular Papers 66 (2), 834-847, 2018 | 52 | 2018 |
| Transformer-based predistortion linearizer for high linearity and high modulation efficiency in mm-wave 5G CMOS power amplifiers SN Ali, P Agarwal, S Gopal, D Heo IEEE Transactions on Microwave Theory and Techniques 67 (7), 3074-3087, 2019 | 36 | 2019 |
| A Continually-Stepped Variable-Gain LNA in 65-nm CMOS Enabled by a Tunable-Transformer for mm-Wave 5G Communications SN Ali, MA Hoque, S Gopal, M Chahardori, MA Mokri, D Heo 2019 IEEE MTT-S International Microwave Symposium (IMS), 926-929, 2019 | 25 | 2019 |
| A spatial multi-bit sub-1-V time-domain matrix multiplier interface for approximate computing in 65-nm CMOS S Gopal, P Agarwal, J Baylon, L Renaud, SN Ali, PP Pande, D Heo IEEE Journal on Emerging and Selected Topics in Circuits and Systems 8 (3 …, 2018 | 21 | 2018 |
| Current reuse triple-band signal source for multi-band wireless network-on-chip J Baylon, SN Ali, P Agarwal, S Gopal, D Heo 2017 IEEE MTT-S International Microwave Symposium (IMS), 1141-1144, 2017 | 18 | 2017 |
| Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC S Gopal, S Das, D Heo, PP Pande Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip, 2017 | 16 | 2017 |
| High-performance and small-form factor near-field inductive coupling for 3-D NoC S Gopal, S Das, P Agarwal, SN Ali, D Heo, PP Pande IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (12 …, 2018 | 14 | 2018 |
| A 16-Gb/s low-power inductorless wideband gain-boosted baseband amplifier with skewed differential topology for wireless network-on-chip J Baylon, X Yu, S Gopal, R Molavi, S Mirabbasi, PP Pande, D Heo IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (11 …, 2018 | 13 | 2018 |
| Analysis of systematic losses in hybrid envelope tracking modulators L Renaud, J Baylon, S Gopal, MA Hoque, D Heo IEEE Transactions on Circuits and Systems I: Regular Papers 66 (4), 1319-1330, 2018 | 12 | 2018 |
| A Highly Efficient Dual-band Harmonic-tuned GaN RF Synchronous Rectifier with Integrated Coupler and Phase Shifter MA Hoque, SN Ali, MA Mokri, S Gopal, M Chahardori, D Heo 2019 IEEE MTT-S International Microwave Symposium (IMS), 1320-1323, 2019 | 11 | 2019 |
| Making a Case for Partially Connected 3D NoC: NFIC versus TSV AI Arka, S Gopal, JR Doppa, D Heo, P Pande ACM Journal on Emerging Technologies in Computing Systems (JETC) 16 (4), 1-17, 2020 | 9 | 2020 |
| An Echo Canceller-less NFIC-TSV Hybrid 3D Interconnect for Simultaneous Bidirectional Vertical Communication S Gopal, P Agarwal, SN Ali, J Baylon, D Heo IEEE MTTS- International Microwave Symposium, 2018 | 7 | 2018 |
| A Low Power Active-Passive Dual Gm-boosted W-band Oscillator for Wireless Network-on-Chip Applications J Baylon, S Gopal, L Renaud, SN Ali, D Heo IEEE MTTS- International Microwave Symposium (IMS), 2018 | 7 | 2018 |
| Energy-Efficient and Robust 3D NoCs with Contactless Vertical Links S Das, S Gopal, D Heo, PP Pande International Conference On Computer Aided Design (ICCAD), 2017, 2017 | 7 | 2017 |
| A hybrid 3D interconnect with 2X bandwidth density employing orthogonal simultaneous bidirectional signaling for 3D NoC S Gopal, S Das, PP Pande, D Heo IEEE Transactions on Circuits and Systems I: Regular Papers 67 (11), 3919-3932, 2020 | 6 | 2020 |
| Trends and opportunities for SRAM based in-memory and near-memory computation S Srinivasa, AK Ramanathan, J Sundaram, D Kurian, S Gopal, N Jain, ... 2021 22nd International Symposium on Quality Electronic Design (ISQED), 547-552, 2021 | 5 | 2021 |
| Dual-Equalization-Path Energy-Area-Efficient Near Field Inductive Coupling for Contactless 3D IC S Gopal, M Chahardori, MA Hoque, SN Ali, MA Mokri, D Heo 2019 IEEE MTT-S International Microwave Symposium (IMS), 742-745, 2019 | 4 | 2019 |
| A reconfigurable asynchronous SERDES for heterogenous chiplet interconnects J Sundaram, S Gopal, TP Thomas, E Burton, E Ramirez 2021 22nd International Symposium on Quality Electronic Design (ISQED), 542-546, 2021 | 2 | 2021 |
| Hierarchical design methodology and optimization for proximity communication based contactless 3D ThruChip interface S Gopal, D Heo, T Karnik 2019 International 3D Systems Integration Conference (3DIC), 1-6, 2019 | 1 | 2019 |
Sheikh Nijam AliQualcomm Inc.Bestätigte E-Mail-Adresse bei qti.qualcomm.com
