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Syed M. Alam
Syed M. Alam
Everspin Technologies, Inc.
Verified email at alum.mit.edu - Homepage
Title
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Cited by
Year
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ...
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International …, 2005
2832005
Three dimensional integrated circuit
SM Alam, IM Elfadel, KW Guarini, M Ieong, PN Kudva, DS Kung, MA Lavin, ...
US Patent 7,312,487, 2007
2812007
Three dimensional integrated circuit and method of design
SM Alam, IM Elfadel, KW Guarini, M Ieong, PN Kudva, DS Kung, MA Lavin, ...
US Patent 7,723,207, 2010
2042010
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
NH Khan, SM Alam, S Hassoun
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (4), 647-658, 2010
1542010
A fully functional 64 Mb DDR3 ST-MRAM built on 90 nm CMOS technology
ND Rizzo, D Houssameddine, J Janesky, R Whig, FB Mancoff, ...
IEEE Transactions on Magnetics 49 (7), 4441-4446, 2013
1402013
A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits
SM Alam, DE Troxel, CV Thompson
Proceedings International Symposium on Quality Electronic Design, 246-251, 2002
1392002
Layout-specific circuit evaluation in 3-D integrated circuits
SM Alam, DE Troxel, CV Thompson
Analog Integrated Circuits and Signal Processing 35 (2), 199-206, 2003
1242003
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
I Savidis, SM Alam, A Jain, S Pozder, RE Jones, R Chatterjee
Microelectronics Journal 41 (1), 9-16, 2010
882010
High density ST-MRAM technology
JM Slaughter, ND Rizzo, J Janesky, R Whig, FB Mancoff, ...
Electron Devices Meeting (IEDM), 2012 IEEE International, 29.3. 1-29.3. 4, 2012
702012
System-level comparison of power delivery design for 2D and 3D ICs
NH Khan, SM Alam, S Hassoun
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
632009
Inter-strata connection characteristics and signal transmission in three-dimensional (3D) integration technology
SM Alam, RE Jones, S Rauf, R Chatterjee
Proceedings of the 8th International Symposium on Quality Electronic Design …, 2007
582007
Method of forming a through-substrate via
TG Sparks, SM Alam, R Chatterjee, S Rauf
US Patent App. 11/558,988, 2008
552008
Low power magnetic quantum cellular automata realization using magnetic multi-layer structures
J Das, SM Alam, S Bhanja
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1 (3 …, 2011
542011
Through-silicon via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs
NH Khan, SM Alam, S Hassoun
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
492009
Ultra-low power hybrid CMOS-magnetic logic architecture
J Das, SM Alam, S Bhanja
IEEE Transactions on Circuits and Systems I: Regular Papers 59 (9), 2008-2016, 2012
472012
Demonstration of a Reliable 1 Gb Standalone Spin-Transfer Torque MRAM For Industrial Applications
S Aggarwal, H Almasi, M DeHerrera, B Hughes, S Ikegawa, J Janesky, ...
2019 IEEE International Electron Devices Meeting (IEDM), 2.1. 1-2.1. 4, 2019
462019
CMOS-embedded STT-MRAM arrays in 2x nm nodes for GP-MCU applications
D Shum, D Houssameddine, ST Woo, YS You, J Wong, KW Wong, ...
2017 Symposium on VLSI Technology, T208-T209, 2017
442017
Circuit level reliability analysis of Cu interconnects
SM Alam, GC Lip, CV Thompson, DE Troxel
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on …, 2004
432004
Thermal–electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints
A Jain, SM Alam, S Pozder, RE Jones
IET Computers & Digital Techniques 5 (3), 169-178, 2011
332011
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations
SM Alam, CL Gan, CV Thompson, DE Troxel
Microelectronics Journal 38 (4-5), 463-473, 2007
322007
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Articles 1–20