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Jimin Maeng
Jimin Maeng
Qualia Oto, Inc.
Verified email at qualiaoto.com
Title
Cited by
Cited by
Year
Ultrasmall integrated 3D micro‐supercapacitors solve energy storage for miniature devices
C Meng, J Maeng, SWM John, PP Irazoqui
Advanced Energy Materials 4 (7), 1301269, 2014
1992014
Three-dimensional microcavity array electrodes for high-capacitance all-solid-state flexible microsupercapacitors
J Maeng, YJ Kim, C Meng, PP Irazoqui
ACS applied materials & interfaces 8 (21), 13458-13465, 2016
552016
Responsive, 3D Electronics Enabled by Liquid Crystal Elastomer Substrates
H Kim*, J Gibson*, J Maeng*, M Saed, K Pimentel, R Rihani, JJ Pancrazio, ...
ACS applied materials & interfaces, 2019
472019
High‐charge‐capacity sputtered iridium oxide neural stimulation electrodes deposited using water vapor as a reactive plasma constituent
J Maeng*, B Chakraborty*, N Geramifard, T Kang, RT Rihani, ...
Journal of Biomedical Materials Research Part B: Applied Biomaterials 108 (3 …, 2020
432020
Chronic recording and electrochemical performance of amorphous silicon carbide-coated Utah electrode arrays implanted in rat motor cortex
A Joshi-Imre, BJ Black, J Abbott, A Kanneganti, R Rihani, B Chakraborty, ...
Journal of neural engineering 16 (4), 046006, 2019
372019
A millimeter-wave system-on-package technology using a thin-film substrate with a flip-chip interconnection
S Song, Y Kim, J Maeng, H Lee, Y Kwon, KS Seo
IEEE transactions on advanced packaging 32 (1), 101-108, 2009
352009
Eyeglasses-powered, contact lens-like platform with high power transfer efficiency
YJ Kim*, J Maeng*, PP Irazoqui
Biomedical microdevices 17 (4), 75, 2015
342015
From softening polymers to multimaterial based bioelectronic devices
M Ecker, A Joshi-Imre, R Modi, CL Frewin, A Garcia-Sandoval, J Maeng, ...
Multifunctional Materials 2 (1), 012001, 2018
332018
Super-capacitor and arrangement for miniature implantable medical devices
PP Irazoqui, O Gall, C Meng, J Maeng
US Patent 10,176,933, 2019
312019
Wirelessly-powered implantable EMG recording system
HS Bhamra, J Maeng, C Meng, R Bercich, O Gall, Y Kim, J Joseph, ...
US Patent 11,737,896, 2023
262023
Electrochemical characteristics of ultramicro-dimensioned SIROF electrodes for neural stimulation and recording
A Ghazavi, J Maeng, M Black, S Salvi, SF Cogan
Journal of neural engineering 17 (1), 016022, 2020
262020
From Chaos to Control: Programmable Crack Patterning with Molecular Order in Polymer Substrates
H Kim, MK Abdelrahman, J Choi, H Kim, J Maeng, S Wang, M Javed, ...
Advanced Materials 33 (22), 2008434, 2021
172021
Liquid crystal elastomers as substrates for 3D, robust, implantable electronics
J Maeng*, RT Rihani*, M Javed, JS Rajput, H Kim, IG Bouton, TA Criss, ...
Journal of Materials Chemistry B, 2020
172020
Parylene interposer as thin flexible 3-D packaging enabler for wireless applications
J Maeng, B Kim, D Ha, WJ Chappell
IEEE transactions on microwave theory and techniques 59 (12), 3410-3418, 2011
172011
Deployable, liquid crystal elastomer-based intracortical probes
RT Rihani, AM Stiller, JO Usoro, J Lawson, H Kim, BJ Black, VR Danda, ...
Acta Biomaterialia 111, 54-64, 2020
162020
Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform
J Maeng, C Meng, PP Irazoqui
Biomedical microdevices 17, 1-10, 2015
162015
Effect of oxidation on intrinsic residual stress in amorphous silicon carbide films
F Deku, S Mohammed, A Joshi‐Imre, J Maeng, V Danda, TJ Gardner, ...
Journal of Biomedical Materials Research Part B: Applied Biomaterials 107 (5 …, 2019
142019
Indium–Gallium–Zinc Oxide Schottky Diodes operating across the glass transition of stimuli‐responsive polymers
E Guerrero, A Polednik, M Ecker, A Joshi‐Imre, W Choi, ...
Advanced Electronic Materials 6 (4), 1901210, 2020
132020
Effect of annealing atmosphere on IGZO thin film transistors on a deformable softening polymer substrate
G Gutierrez-Heredia, J Maeng, J Conde, O Rodriguez-Lopez, WE Voit
Semiconductor Science and Technology 33 (9), 095001, 2018
122018
Embedded Decoupling Capacitors up to 80 nF on Multichip Module-Deposited with Quasi-Three-Dimensional Metal–Insulator–Metal Structure
J Maeng, S Song, N Jeon, CS Yoo, H Lee, K Seo
Japanese journal of applied physics 47 (4S), 2535, 2008
112008
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Articles 1–20