| Quasi-TEM description of MMIC coplanar lines including conductor-loss effects W Heinrich IEEE transactions on microwave theory and techniques 41 (1), 45-52, 1993 | 424 | 1993 |
| Full-wave analysis of conductor losses on MMIC transmission lines W Heinrich IEEE Transactions on Microwave Theory and Techniques 38 (10), 1468-1472, 1990 | 219 | 1990 |
| Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz A Jentzsch, W Heinrich IEEE Transactions on Microwave Theory and Techniques 49 (5), 871-878, 2001 | 184 | 2001 |
| Analysis of the survivability of GaN low-noise amplifiers M Rudolph, R Behtash, R Doerner, K Hirche, J Wurfl, W Heinrich, ... IEEE Transactions on Microwave Theory and Techniques 55 (1), 37-43, 2007 | 173 | 2007 |
| Model of thin-film microstrip line for circuit design F Schnieder, W Heinrich IEEE transactions on microwave theory and techniques 49 (1), 104-110, 2001 | 141 | 2001 |
| Millimeter-wave characteristics of flip-chip interconnects for multichip modules W Heinrich, A Jentzsch, G Baumann IEEE Transactions on Microwave Theory and Techniques 46 (12), 2264-2268, 1998 | 135 | 1998 |
| Low-dispersion thin-film microstrip lines with cyclotene (benzocyclobutene) as dielectric medium HM Heiliger, M Nagel, HG Roskos, H Kurz, F Schnieder, W Heinrich, ... Applied physics letters 70 (17), 2233-2235, 1997 | 120 | 1997 |
| A high-sensitivity AlGaN/GaN HEMT terahertz detector with integrated broadband bow-tie antenna M Bauer, A Rämer, SA Chevtchenko, KY Osipov, D Čibiraitė, ... IEEE Transactions on Terahertz Science and Technology 9 (4), 430-444, 2019 | 116 | 2019 |
| The flip-chip approach for millimeter wave packaging W Heinrich IEEE Microwave magazine 6 (3), 36-45, 2005 | 106 | 2005 |
| Improved finite-difference formulation in frequency domain for three-dimensional scattering problems K Beilenhoff, W Heinrich, HL Hartnagel IEEE Transactions on Microwave Theory and Techniques 40 (3), 540-546, 1992 | 106 | 1992 |
| Open and short circuits in coplanar MMIC's K Beilenhoff, H Klingbeil, W Heinrich, HL Hartnagel IEEE Transactions on microwave theory and techniques 41 (9), 1534-1537, 1993 | 99 | 1993 |
| Modeling dispersion and radiation characteristics of conductor-backed CPW with finite ground width F Schnieder, T Tischler, W Heinrich IEEE Transactions on Microwave Theory and Techniques 51 (1), 137-143, 2003 | 88 | 2003 |
| High-frequency FET noise performance: A new approach A Cappy, W Heinrich IEEE transactions on electron devices 36 (2), 403-409, 1989 | 85 | 1989 |
| Wave propagation on MESFET electrodes and its influence on transistor gain W Heinrich, HL Hartnagel IEEE transactions on microwave theory and techniques 35 (1), 1-8, 1987 | 83 | 1987 |
| Coplanar passive elements on Si substrate for frequencies up to 110 GHz W Heinrich, J Gerdes, FJ Schmuckle, C Rheinfelder, K Strohm IEEE Transactions on microwave theory and techniques 46 (5), 709-712, 1998 | 82 | 1998 |
| Distributed equivalent-circuit model for traveling-wave FET design W Heinrich IEEE transactions on microwave theory and techniques 35 (5), 487-491, 1987 | 82 | 1987 |
| Crosstalk corrections for coplanar-waveguide scattering-parameter calibrations DF Williams, FJ Schmückle, R Doerner, GN Phung, U Arz, W Heinrich IEEE transactions on microwave theory and techniques 62 (8), 1748-1761, 2014 | 67 | 2014 |
| RF class-S power amplifiers: State-of-the-art results and potential A Wentzel, C Meliani, W Heinrich 2010 IEEE MTT-S International Microwave Symposium, 812-815, 2010 | 67 | 2010 |
| LTCC as MCM substrate: Design of strip-line structures and flip-chip interconnects FJ Schmuckle, A Jentzsch, W Heinrich, J Butz, M Spinnler 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No. 01CH37157 …, 2001 | 62 | 2001 |
| Analysis of packaged microwave integrated circuits by FDTD P Mezzanotte, M Mongiardo, L Roselli, R Sorrentino, W Heinrich IEEE transactions on microwave theory and techniques 42 (9), 1796-1801, 1994 | 57 | 1994 |
