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Co-authors
Xuchun GuiSun Yat-sen UniversityVerified email at mail.sysu.edu.cn
Azalea ZHUSouthern university of science and technologyVerified email at sustc.edu.cn
XIANG Rong @ UTokyoThe University of TokyoVerified email at photon.t.u-tokyo.ac.jp
Ping ShengHong Kong University of Science and TechnologyVerified email at ust.hk
Ning WangHong Kong University of Science and TechnologyVerified email at ust.hk
Che Ting ChanProfessor of Physics, Hong Kong University of Science and TechnologyVerified email at ust.hk
xixiang zhangProfessor, Division of Physical Science and engineering, KAUSTVerified email at kaust.edu.sa
Hai Zhu 朱海Research Fellow of EEE, NTU, SingaporeVerified email at ntu.edu.sg
Tianzhun WUShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Jianting YeZernike Institute of Advanced Materials, University of GroningenVerified email at rug.nl
Handong SunNanyang Technological UniversityVerified email at ntu.edu.sg
Anyuan CaoPeking UniversityVerified email at pku.edu.cn
Mingming ChenJiangsu UniversityVerified email at ujs.edu.cn
Guofang LiUniversity of British ColumbiaVerified email at ubc.ca
Su Yu QuanSchool of Physics, Sun Yat-sen UniversityVerified email at mail2.sysu.edu.cn
Wu ShiLawrence Berkeley National LaboratoryVerified email at lbl.gov
Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
Riichiro SaitoProfessor of Physics, Tohoku UniversityVerified email at flex.phys.tohoku.ac.jp
Margaret W ChenThe Aerospace CorporationVerified email at aero.org
Zi Kang TANG
Institute of Physics and Materials Engineering, University of Macau
Verified email at umac.mo