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Alexander Kolew
Alexander Kolew
Karlsruhe Institute of Technology
Bestätigte E-Mail-Adresse bei kolew.eu
Titel
Zitiert von
Zitiert von
Jahr
3D high throughput screening and profiling of embryoid bodies in thermoformed microwell plates
EJ Vrij, S Espinoza, M Heilig, A Kolew, M Schneider, CA Van Blitterswijk, ...
Lab on a Chip 16 (4), 734-742, 2016
762016
Integration of organic semiconductor lasers and single-mode passive waveguides into a PMMA substrate
C Vannahme, S Klinkhammer, A Kolew, PJ Jakobs, M Guttmann, S Dehm, ...
Microelectronic engineering 87 (5-8), 693-695, 2010
632010
Hot embossing of micro and sub-micro structured inserts for polymer replication
A Kolew, D Münch, K Sikora, M Worgull
Microsystem technologies 17, 609-618, 2011
602011
All-polymer organic semiconductor laser chips: Parallel fabrication and encapsulation
C Vannahme, S Klinkhammer, MB Christiansen, A Kolew, A Kristensen, ...
Optics Express 18 (24), 24881-24887, 2010
562010
Tunable diffractive optical elements based on shape-memory polymers fabricated via hot embossing
S Schauer, T Meier, M Reinhard, M Röhrig, M Schneider, M Heilig, ...
ACS applied materials & interfaces 8 (14), 9423-9430, 2016
482016
Liquid polystyrene: a room-temperature photocurable soft lithography compatible pour-and-cure-type polystyrene
TM Nargang, L Brockmann, PM Nikolov, D Schild, D Helmer, N Keller, ...
Lab on a Chip 14 (15), 2698-2708, 2014
442014
Hot embossing of high performance polymers
M Worgull, A Kolew, M Heilig, M Schneider, H Dinglreiter, B Rapp
Microsystem technologies 17, 585-592, 2011
402011
Hot pulling and embossing of hierarchical nano-and micro-structures
M Röhrig, M Schneider, G Etienne, F Oulhadj, F Pfannes, A Kolew, ...
Journal of Micromechanics and Microengineering 23 (10), 105014, 2013
322013
Development and experimental validation of an analytical model to predict the demoulding force in hot embossing
F Omar, E Brousseau, A Elkaseer, A Kolew, P Prokopovich, S Dimov
Journal of Micromechanics and Microengineering 24 (5), 055007, 2014
232014
Hot embossing and thermoforming of biodegradable three-dimensional wood structures
M Worgull, M Schneider, M Röhrig, T Meier, M Heilig, A Kolew, K Feit, ...
RSC advances 3 (43), 20060-20064, 2013
222013
Nanothermoforming of hierarchical optical components utilizing shape memory polymers as active molds
N Schneider, C Zeiger, A Kolew, M Schneider, J Leuthold, H Hölscher, ...
Optical Materials Express 4 (9), 1895-1902, 2014
192014
Programmable and self-demolding microstructured molds fabricated from shape-memory polymers
T Meier, J Bur, M Reinhard, M Schneider, A Kolew, M Worgull, H Hölscher
Journal of Micromechanics and Microengineering 25 (6), 065017, 2015
162015
Hot embossing of photonic crystal polymer structures with a high aspect ratio
M Schelb, C Vannahme, A Kolew, T Mappes
Journal of Micromechanics and Microengineering 21 (2), 025017, 2011
162011
Mould insert fabrication of a single-mode fibre connector alignment structure optimized by justified partial metallization
M Wissmann, N Barié, M Guttmann, M Schneider, A Kolew, H Besser, ...
Journal of Micromechanics and Microengineering 25 (3), 035008, 2015
132015
Hot embossing of transparent high aspect ratio micro parts
A Kolew, M Heilig, M Schneider, D Münch, R Ezzat, N Schneider, ...
Microsystem technologies 20, 1967-1973, 2014
112014
Heißprägen von Verbundfolien für mikrofluidische Anwendungen
A Kolew
KIT Scientific Publishing, 2014
102014
Hot-embossing replication of self-centering optical fiber alignment structures prototyped by deep proton writing
E Ebraert, M Wissmann, M Guttmann, A Kolew, M Worgull, N Barié, ...
Optical Engineering 55 (7), 076112-076112, 2016
62016
Replication of optical components by hot embossing
M Worgull, M Schneider, M Heilig, A Kolew, H Dinglreiter, J Mohr
Micro-Optics 2010 7716, 25-38, 2010
52010
Hot embossing of thermoplastic multilayered stacks
A Kolew, M Heilig, M Schneider, K Sikora, D Münch, M Worgull
Microsystem technologies 18, 1857-1861, 2012
42012
Bulk metallic glass based tool-making process chain for micro-and nano-replication
P Vella, SS Dimov, A Kolew, E Minev, KB Popov, FA Lacan, CA Griffiths, ...
Research Publishing, 2012
32012
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