Dr. Md Muktadir Billah
Dr. Md Muktadir Billah
Bangladesh University of Engineering and Technology, University of Central Florida
ยืนยันอีเมลแล้วที่ knights.ucf.edu
ชื่อ
อ้างโดย
อ้างโดย
ปี
Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties
MM Billah, KM Shorowordi, A Sharif
Journal of alloys and compounds 585, 32-39, 2014
542014
Experimental studies on fly ash-sand-lime bricks with gypsum addition
T Banu, MM Billah, F Gulshan, ASW Kurny
American Journal of Materials Engineering and Technologi 1 (3), 35-40, 2013
212013
Strength of MWCNT-reinforced 70Sn-30Bi solder alloys
MM Billah, Q Chen
Journal of Electronic Materials 45 (1), 98-103, 2016
102016
Thermal conductivity of Ni-coated MWCNT reinforced 70Sn-30Bi alloy
MM Billah, Q Chen
Composites Part B: Engineering 129, 162-168, 2017
62017
Sn/MWCNT nanocomposites fabricated by ultrasonic dispersion of Ni-coated MWCNTs in Molten Tin
MM Billah, Q Chen
Journal of Electronic Materials 47 (4), 2366-2373, 2018
12018
Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and Mechanical Properties of Sn-9Zn Lead-Free Solder Alloy
MM Billah, KM Shorowordi
Applied Mechanics and Materials 229, 271-275, 2012
12012
Effect of the microwave-assisted thermal annealing on structural and optical properties of the sol–gel-derived ZnO thin films
MF Ishtiyaq, AA Bhuiyan, U Roy, MM Billah
SN Applied Sciences 2 (7), 1-6, 2020
2020
Al–CNT–Ni composite with significantly increased strength and hardness
MM Billah, Q Chen
SN Applied Sciences 1 (6), 521, 2019
2019
Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials
MM Billah
Harsh Environment Electronics: Interconnect Materials and Performance Assessment, 2019
2019
Effect of Activation Site Density on Copper Encapsulation of MWCNTs by Electroless Deposition
MM Billah, Q Chen
IOP Conference Series: Materials Science and Engineering 438 (1), 012003, 2018
2018
ระบบไม่สามารถดำเนินการได้ในขณะนี้ โปรดลองใหม่อีกครั้งในภายหลัง
บทความ 1–10