| Chemical and mechanical aspects of a Co-Cu planarization scheme based on an alkaline slurry formulation MC Turk, X Shi, DAJ Gonyer, D Roy ECS Journal of Solid State Science and Technology 5 (2), P88, 2015 | 63 | 2015 |
| Tribo-electrochemical characterization of Ru, Ta and Cu CMP systems using percarbonate based solutions X Shi, DE Simpson, D Roy ECS Journal of Solid State Science and Technology 4 (11), P5058, 2015 | 45 | 2015 |
| Minimizing the effects of galvanic corrosion during chemical mechanical planarization of aluminum in moderately acidic slurry solutions X Shi, SE Rock, MC Turk, D Roy Materials Chemistry and Physics 136 (2-3), 1027-1037, 2012 | 40 | 2012 |
| Cobalt CMP development for 7nm logic device C Wu, JH Han, X Shi, DR Koli, D Penigalapati ECS Transactions 77 (5), 93, 2017 | 37 | 2017 |
| The role of chemisorbed hydroxyl species in alkaline electrocatalysis of glycerol on gold X Shi, DE Simpson, D Roy Physical Chemistry Chemical Physics 17 (17), 11432-11444, 2015 | 25 | 2015 |
| Experimental considerations for temperature controlled measurements of fast charge recombination times in dye sensitized solar cells using open circuit voltage decay and … SE Rock, X Shi, JE Garland, D Roy Measurement 53, 71-82, 2014 | 18 | 2014 |
| Glass transition, viscosity, and conductivity correlations in solutions of lithium salts in PEGylated imidazolium ionic liquids L Wu, RI Venkatanarayananan, X Shi, D Roy, S Krishnan Journal of Molecular Liquids 198, 398-408, 2014 | 16 | 2014 |
| Advanced structure for self-aligned contact and method for producing the same H Huang, D Koli, Y Zhou, X Shi, CC Chang, TF Chao US Patent 10,211,103, 2019 | 10 | 2019 |
| A new approach to the formation mechanism of tungsten void defect in chemical mechanical polishing HJ Kim, B Egan, X Shi, JH Han ECS Journal of Solid State Science and Technology 7 (11), P693, 2018 | 8 | 2018 |
| Electrocatalysis of hypophosphite on nickel investigated using time resolved fourier transform electrochemical impedance spectroscopy X Shi, DE Simpson, MJ Walters, CM Pettit, D Roy Journal of The Electrochemical Society 161 (9), H583, 2014 | 7 | 2014 |
| Material combinations for polish stops and gate caps H Huang, SHU Jiehui, CC Chang, X Shi, J Gao, H Cao US Patent App. 15/956,306, 2019 | 6 | 2019 |
| Effect of reactive ion etch on the polishing selectivity during silicon nitride chemical mechanical polishing for sub-10 nm logic device J Han, X Shi, C Wu, D Koli, HJ Kim ECS Journal of Solid State Science and Technology 6 (4), P101, 2017 | 5 | 2017 |
| A Study on Selectivity during SiN Chemical Mechanical Polishing for Sub-10nm Logic Device J Han, X Shi, C Wu, D Koli International Conference on Planarization, 2016 | 5* | 2016 |
| 聚苯胺薄膜在不同质子酸溶液中的生长 李冀蜀， 林晨， 顾大伟， 史兴朝， 沈临江， 杨南如 南京工业大学学报 (自然科学版) 31 (2), 5-9, 2009 | 3 | 2009 |
| Brush cleaning effect on tugnsten voids defect in chemical mechanical polishing: CFM: Contamination free manufacturing HJ Kim, B Egan, R Solan, X Shi, JH Han 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2018 | 2 | 2018 |
| Structure and method for inhibiting cobalt diffusion Q Fang, H Huang, S Tsai, JH Zhang, X Shi, TF Chao US Patent 9,865,543, 2018 | 2 | 2018 |
| Gate structures JH Han, X Shi, D Koli US Patent App. 15/348,356, 2018 | | 2018 |
| Methods for nitride planarization using dielectric H Sheng, H Huang, TF Chao, SHU Jiehui, J Liu, X Shi, L Economikos US Patent 9,966,272, 2018 | | 2018 |
| Experimental Studies of Selected Aqueous Electrochemical Systems Relevant for Materials Processing in the Fabrications of Microelectronic Components and Direct Alcohol Fuel Cells X Shi Clarkson University, 2015 | | 2015 |
Dipankar RoyProfessor of Physics, Clarkson UniversityVerified email at clarkson.edu
