| Copper metallization for high performance silicon technology R Rosenberg, DC Edelstein, CK Hu, KP Rodbell Annual review of materials science 30 (1), 229-262, 2000 | 579 | 2000 |
| Mechanisms for microstructure evolution in electroplated copper thin films near room temperature JME Harper, C Cabral Jr, PC Andricacos, L Gignac, IC Noyan, KP Rodbell, ... Journal of applied physics 86 (5), 2516-2525, 1999 | 455 | 1999 |
| Electromigration path in Cu thin-film lines CK Hu, R Rosenberg, KY Lee Applied Physics Letters 74 (20), 2945-2947, 1999 | 423 | 1999 |
| Reduced electromigration and stressed induced migration of Cu wires by surface coating CK Hu, R Rosenberg, JM Rubino, CJ Sambucetti, AK Stamper US Patent 6,342,733, 2002 | 406 | 2002 |
| Copper interconnections and reliability CK Hu, JME Harper Materials Chemistry and Physics 52 (1), 5-16, 1998 | 385 | 1998 |
| Reduced electromigration of Cu wires by surface coating CK Hu, L Gignac, R Rosenberg, E Liniger, J Rubino, C Sambucetti, ... Applied Physics Letters 81 (10), 1782-1784, 2002 | 363 | 2002 |
| Copper interconnection integration and reliability CK Hu, B Luther, FB Kaufman, J Hummel, C Uzoh, DJ Pearson Thin Solid Films 262 (1-2), 84-92, 1995 | 319 | 1995 |
| Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect CJ Sambucetti, X Chen, SC Seo, BN Agarwala, CK Hu, NE Lustig, ... US Patent 6,573,606, 2003 | 305 | 2003 |
| Reduced electromigration and stressed induced migration of Cu wires by surface coating CK Hu, R Rosenberg, J Rubino, C Sambucetti, A Stamper US Patent App. 10/054,605, 2002 | 263 | 2002 |
| Electromigration in Al (Cu) two‐level structures: Effect of Cu and kinetics of damage formation CK Hu, MB Small, PS Ho Journal of applied physics 74 (2), 969-978, 1993 | 233 | 1993 |
| Copper interconnection structure incorporating a metal seed layer DC Edelstein, JME Harper, CK Hu, AH Simon, CE Uzoh US Patent 6,181,012, 2001 | 224 | 2001 |
| In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects KL Lee, CK Hu, KN Tu Journal of applied physics 78 (7), 4428-4437, 1995 | 209 | 1995 |
| Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction PC Wang, GS Cargill III, IC Noyan, CK Hu Applied Physics Letters 72 (11), 1296-1298, 1998 | 201 | 1998 |
| Copper-polyimide wiring technology for VLSI circuits CK Hu, MB Small, F Kaufman, DJ Pearson Materials Research Society Symposium Proceedings VLSI 1990, 369-373, 1990 | 191 | 1990 |
| Electromigration of Cu/low dielectric constant interconnects CK Hu, L Gignac, R Rosenberg Microelectronics reliability 46 (2-4), 213-231, 2006 | 189 | 2006 |
| Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines CK Hu, KP Rodbell, TD Sullivan, KY Lee, DP Bouldin IBM Journal of Research and Development 39 (4), 465-497, 1995 | 172 | 1995 |
| Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps CK Hu, L Gignac, E Liniger, B Herbst, DL Rath, ST Chen, S Kaldor, ... Applied Physics Letters 83 (5), 869-871, 2003 | 157 | 2003 |
| Sub‐μm, planarized, Nb‐AlOx‐Nb Josephson process for 125 mm wafers developed in partnership with Si technology MB Ketchen, D Pearson, AW Kleinsasser, CK Hu, M Smyth, J Logan, ... Applied physics letters 59 (20), 2609-2611, 1991 | 146 | 1991 |
| Reduced Cu interface diffusion by CoWP surface coating CK Hu, L Gignac, R Rosenberg, E Liniger, J Rubino, C Sambucetti, ... Microelectronic Engineering 70 (2-4), 406-411, 2003 | 145 | 2003 |
| Copper recess process with application to selective capping and electroless plating ST Chen, TJ Dalton, KM Davis, CK Hu, FF Jamin, SK Kaldor, M Krishnan, ... US Patent 6,975,032, 2005 | 139 | 2005 |
