Peter Timmermans
Peter Timmermans
Other namesP.H.M. Timmermans
Senior Scientist, Philips Research
Verified email at
Cited by
Cited by
The influence of intrinsic strain softening on strain localization in polycarbonate: modeling and experimental validation
LE Govaert, PHM Timmermans, WAM Brekelmans
J. Eng. Mater. Technol. 122 (2), 177-185, 2000
Stretching-induced interconnect delamination in stretchable electronic circuits
O Van Der Sluis, YY Hsu, PHM Timmermans, M Gonzalez, ...
Journal of Physics D: Applied Physics 44 (3), 034008, 2010
Copper–rubber interface delamination in stretchable electronics
JPM Hoefnagels, J Neggers, PHM Timmermans, O van Der Sluis, ...
Scripta Materialia 63 (8), 875-878, 2010
Design and implementation of flexible and stretchable systems
M Gonzalez, B Vandevelde, W Christiaens, YY Hsu, F Iker, F Bossuyt, ...
Microelectronics Reliability 51 (6), 1069-1076, 2011
Mechanical failure analysis of thin film transistor devices on steel and polyimide substrates for flexible display applications
Y Leterrier, A Pinyol, D Gilliéron, JAE Månson, PHM Timmermans, ...
Engineering Fracture Mechanics 77 (4), 660-670, 2010
Effect of a hard coat layer on buckle delamination of thin ITO layers on a compliant elasto-plastic substrate: An experimental–numerical approach
O Van der Sluis, AA Abdallah, PCP Bouten, PHM Timmermans, ...
Engineering Fracture Mechanics 78 (6), 877-889, 2011
Numerical and experimental study of critical roof collapse conditions in soft lithography
MMJ Decre, PHM Timmermans, O Van Der Sluis, R Schroeders
Langmuir 21 (17), 7971-7978, 2005
Analysis of the three-dimensional delamination behavior of stretchable electronics applications
O van der Sluis, PHM Timmermans, EJL Van der Zanden, ...
EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009
Numerical prediction of failure paths at a roughened metal/polymer interface
SPM Noijen, O van der Sluis, PHM Timmermans, GQ Zhang
Microelectronics Reliability 49 (9-11), 1315-1318, 2009
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics
O van der Sluis, RAB Engelen, PHM Timmermans, GQ Zhang
Microelectronics Reliability 49 (8), 853-860, 2009
Thermo-mechanical analysis of flexible and stretchable systems
M Gonzalez, B Vandevelde, W Christiaens, YY Hsu, F Iker, F Bossuyt, ...
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010
Broadband ultrasound transducer
S Shulepov, PHM Timmermans, P Dirksen
US Patent 11,400,487, 2022
A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces
SPM Noijen, O Van der Sluis, PHM Timmermans, GQ Zhang
Engineering Fracture Mechanics 83, 8-25, 2012
Evaluation of a constitutive model for solid polymeric materials: model selection and parameter quantification
PHM Timmermans
Correlation between electrical and mechanical properties of polymer composite
IB Vendik, OG Vendik, VP Afanasjev, IM Sokolova, DA Chigirev, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1697-1702, 2011
Mechanics of tunnelling cracks in trilayer elastic materials in tension
J Andersons, PHM Timmermans, J Modniks
International journal of fracture 148, 233-241, 2007
An extensive investigation of the four point bending test for interface characterization
SPM Noijen, O Van Der Sluis, PHM Timmermans
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012
Glass package for sealing a device, and system comprising glass package
FAG Van Dijk, RHM Sanders, PHM Timmermans
US Patent 9,028,932, 2015
On the Effect of Microscopic Surface Roughness on Macroscopic Polymer–Metal Adhesion
O van der Sluis, SPM Noijen, PHM Timmermans
Solid state lighting reliability: components to systems, 317-327, 2012
23.1: Invited Paper: Models and Experiments of Mechanical Integrity for Flexible Displays
Y Leterrier, A Pinyol, P Dumont, D Gilliéron, V Mewani, JA Månson, ...
SID Symposium Digest of Technical Papers 39 (1), 310-313, 2008
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