| Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation M Zhou, MP Clode Mechanics of Materials 27 (2), 63-76, 1998 | 144 | 1998 |
| Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates HR Kotadia, O Mokhtari, MP Clode, MA Green, SH Mannan Journal of Alloys and Compounds 511 (1), 176-188, 2012 | 126 | 2012 |
| Materials and processes for implementing high-temperature liquid interconnects SH Mannan, MP Clode IEEE transactions on advanced packaging 27 (3), 508-514, 2004 | 70 | 2004 |
| Reactions of Sn-3.5 Ag-based solders containing Zn and Al additions on Cu and Ni (P) substrates HR Kotadia, O Mokhtari, M Bottrill, MP Clode, MA Green, SH Mannan Journal of electronic materials 39, 2720-2731, 2010 | 59 | 2010 |
| Formation of die lines during extrusion of AA6063 MP Clode, T Sheppard Materials Science and Technology 6 (8), 755-763, 1990 | 57 | 1990 |
| Extrusion limit diagrams containing structural and topological information for AA 6063 aluminium alloy MP Clade, T Sheppard Materials science and technology 9 (4), 313-318, 1993 | 39 | 1993 |
| Disabling of nanoparticle effects at increased temperature in nanocomposite solders O Mokhtari, A Roshanghias, R Ashayer, HR Kotadia, F Khomamizadeh, ... Journal of electronic materials 41, 1907-1914, 2012 | 28 | 2012 |
| Dissolution of solids in contact with liquid solder S Mannan, MP Clode Soldering & surface mount technology 16 (3), 31-33, 2004 | 26 | 2004 |
| Hot torsion tests to model the deformation behavior of aluminium alloys at hot working temperatures M Zhou, MP Clode Journal of materials processing technology 72 (1), 78-85, 1997 | 26 | 1997 |
| Cross-section preparation for solder joints and MEMS device using argon ion beam milling OM Amirmajdi, R Ashyer-Soltani, MP Clode, SH Mannan, Y Wang, ... IEEE transactions on electronics packaging manufacturing 32 (4), 265-271, 2009 | 21 | 2009 |
| A constitutive model and its identification for the deformation characterized by dynamic recovery M Zhou, MP Clode | 20 | 1997 |
| Modelling of high temperature viscoplastic flow of aluminium alloys by hot torsion testing M Zhou, MP Clode Materials science and technology 13 (10), 818-824, 1997 | 18 | 1997 |
| A finite element analysis for the least temperature rise in a hot torsion test specimen M Zhou, MP Clode Finite elements in analysis and design 31 (1), 1-14, 1998 | 17 | 1998 |
| The origin of surface defects during extrusion of AA6063 alloy T Sheppard, MP Clode 4th International aluminium extrusion technology seminar, 329-341, 1988 | 17 | 1988 |
| Hot torsion testing to model the extrusion processes MP Clode, A Industry Aluminium Industry 11 (1), 34-39, 1992 | 13 | 1992 |
| Thermal analysis of the torsion test under hot-working conditions M Zhou, MP Clode Computational materials science 9 (3-4), 411-419, 1998 | 12 | 1998 |
| Aluminium Technology’86 MP Clode, T Sheppard The Institute of Metals 1, 230-239, 1986 | 10 | 1986 |
| Prediction of fatigue crack growth in notched members HY Ahmad, MP Clode, JR Yates International journal of fatigue 19 (10), 703-712, 1997 | 9 | 1997 |
| Material flow and microstructural development during extrusion of aa6063 MP Clode PROCEEDINGS OF INTERNATIONAL ALUMINIUM EXTRUSION TECHNOLOGY SEMINAR 2, 79-79, 1993 | 8 | 1993 |
| Simulation and analysis of deformation in conform extrusion M Clode, N Carr, HY Ahmad PROCEEDINGS OF INTERNATIONAL ALUMINIUM EXTRUSION TECHNOLOGY SEMINAR 2, 441-448, 1996 | 7 | 1996 |
