| Synthesis Methods of Two-Dimensional MoS2: A Brief Review J Sun, X Li, W Guo, M Zhao, X Fan, Y Dong, C Xu, J Deng, Y Fu Crystals 7 (7), 198, 2017 | 199 | 2017 |
| Synthesis of graphene quantum dots and their applications in drug delivery C Zhao, X Song, Y Liu, Y Fu, L Ye, N Wang, F Wang, L Li, ... Journal of Nanobiotechnology 18, 1-32, 2020 | 195 | 2020 |
| Graphene related materials for thermal management Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ... 2D Materials 7 (1), 012001, 2020 | 190 | 2020 |
| Functionalization mediates heat transport in graphene nanoflakes H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ... Nature Communications 7 (1), 11281, 2016 | 162 | 2016 |
| Improved heat spreading performance of functionalized graphene in microelectronic device application Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ... Advanced Functional Materials 25 (28), 4430-4435, 2015 | 138 | 2015 |
| Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots Z Gao, Y Zhang, Y Fu, MMF Yuen, J Liu Carbon 61, 342-348, 2013 | 130 | 2013 |
| A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity Y Fu, N Nabiollahi, T Wang, S Wang, Z Hu, B Carlberg, Y Zhang, X Wang, ... Nanotechnology 23 (4), 045304, 2012 | 95 | 2012 |
| Through-silicon vias filled with densified and transferred carbon nanotube forests T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu IEEE Electron Device Letters 33 (3), 420-422, 2012 | 87 | 2012 |
| Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing J Bao, K Jeppson, M Edwards, Y Fu, L Ye, X Lu, J Liu Electronic Materials Letters 12, 1-16, 2016 | 86 | 2016 |
| Ultrafast transfer of metal-enhanced carbon nanotubes at low temperature for large-scale electronics assembly Y Fu, Y Qin, T Wang, S Chen, J Liu Adv. Mater 22 (44), 5039-5042, 2010 | 70 | 2010 |
| Templated growth of covalently bonded three-dimensional carbon nanotube networks originated from graphene Y Fu, B Carlberg, N Lindahl, N Lindvall, J Bielecki, A Matic, Y Song, Z Hu, ... Advanced Materials 24 (12), 1576-1581, 2012 | 57 | 2012 |
| Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ... Journal of Physics D: Applied Physics 49 (26), 265501, 2016 | 51 | 2016 |
| Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ... Nanotechnology 27 (33), 335705, 2016 | 48 | 2016 |
| Vertically stacked carbon nanotube-based interconnects for through silicon via application D Jiang, W Mu, S Chen, Y Fu, K Jeppson, J Liu IEEE Electron Device Letters 36 (5), 499-501, 2015 | 45 | 2015 |
| Compact and low loss electrochemical capacitors using a graphite/carbon nanotube hybrid material for miniaturized systems Q Li, S Sun, AD Smith, P Lundgren, Y Fu, P Su, T Xu, L Ye, L Sun, J Liu, ... Journal of Power Sources 412, 374-383, 2019 | 41 | 2019 |
| A portable micro glucose sensor based on copper-based nanocomposite structure H Chen, G Fan, J Zhao, M Qiu, P Sun, Y Fu, D Han, G Cui New Journal of Chemistry 43 (20), 7806-7813, 2019 | 40 | 2019 |
| Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ... Carbon 106, 195-201, 2016 | 36 | 2016 |
| Carbon nanotubes for electronics manufacturing and packaging: From growth to integration J Liu, D Jiang, Y Fu, T Wang Advances in Manufacturing 1, 13-27, 2013 | 30 | 2013 |
| Nanostructured polymer-metal composite for thermal interface material applications B Carlberg, T Wang, Y Fu, J Liu, D Shangguan 2008 58th Electronic Components and Technology Conference, 191-197, 2008 | 28 | 2008 |
| Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging S Sun, S Chen, X Luo, Y Fu, L Ye, J Liu Microelectronics Reliability 56, 129-135, 2016 | 26 | 2016 |
