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Yifeng Fu
Yifeng Fu
Chalmers University of Technology, SHT Smart High Tech, Central South University
Verified email at chalmers.se - Homepage
Title
Cited by
Cited by
Year
Functionalization mediates heat transport in graphene nanoflakes
H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ...
Nature Communications 7 (1), 1-9, 2016
1332016
Improved heat spreading performance of functionalized graphene in microelectronic device application
Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ...
Advanced Functional Materials 25 (28), 4430-4435, 2015
1142015
Graphene related materials for thermal management
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
2D Materials 7 (1), 012001, 2019
1072019
Synthesis Methods of Two-Dimensional MoS2: A Brief Review
J Sun, X Li, W Guo, M Zhao, X Fan, Y Dong, C Xu, J Deng, Y Fu
Crystals 7 (7), 198, 2017
1072017
Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Z Gao, Y Zhang, Y Fu, MMF Yuen, J Liu
Carbon 61, 342-348, 2013
1072013
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Y Fu, N Nabiollahi, T Wang, S Wang, Z Hu, B Carlberg, Y Zhang, X Wang, ...
Nanotechnology 23 (4), 045304, 2012
822012
Through-silicon vias filled with densified and transferred carbon nanotube forests
T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu
IEEE Electron Device Letters 33 (3), 420-422, 2012
772012
Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing
J Bao, K Jeppson, M Edwards, Y Fu, L Ye, X Lu, J Liu
Electronic Materials Letters 12 (1), 1-16, 2016
642016
Ultrafast transfer of metal‐enhanced carbon nanotubes at low temperature for large‐scale electronics assembly
Y Fu, Y Qin, T Wang, S Chen, J Liu
Advanced materials 22 (44), 5039-5042, 2010
622010
Synthesis of graphene quantum dots and their applications in drug delivery
C Zhao, X Song, Y Liu, Y Fu, L Ye, N Wang, F Wang, L Li, ...
Journal of Nanobiotechnology 18 (1), 1-32, 2020
572020
Templated Growth of Covalently Bonded Three‐Dimensional Carbon Nanotube Networks Originated from Graphene
Y Fu, B Carlberg, N Lindahl, N Lindvall, J Bielecki, A Matic, Y Song, Z Hu, ...
Advanced Materials 24 (12), 1576-1581, 2012
542012
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ...
Journal of Physics D: Applied Physics 49 (26), 265501, 2016
442016
Vertically stacked carbon nanotube-based interconnects for through silicon via application
D Jiang, W Mu, S Chen, Y Fu, K Jeppson, J Liu
IEEE Electron Device Letters 36 (5), 499-501, 2015
392015
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ...
Nanotechnology 27 (33), 335705, 2016
362016
Compact and low loss electrochemical capacitors using a graphite/carbon nanotube hybrid material for miniaturized systems
Q Li, S Sun, AD Smith, P Lundgren, Y Fu, P Su, T Xu, L Ye, L Sun, J Liu, ...
Journal of Power Sources 412, 374-383, 2019
312019
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ...
Carbon 106, 195-201, 2016
302016
Nanostructured polymer-metal composite for thermal interface material applications
B Carlberg, T Wang, Y Fu, J Liu, D Shangguan
2008 58th Electronic Components and Technology Conference, 191-197, 2008
282008
A portable micro glucose sensor based on copper-based nanocomposite structure
H Chen, G Fan, J Zhao, M Qiu, P Sun, Y Fu, D Han, G Cui
New Journal of Chemistry 43 (20), 7806-7813, 2019
252019
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
S Sun, S Chen, X Luo, Y Fu, L Ye, J Liu
Microelectronics Reliability 56, 129-135, 2016
232016
Improving thermal transport at carbon hybrid interfaces by covalent bonds
S Sun, MK Samani, Y Fu, T Xu, L Ye, M Satwara, K Jeppson, T Nilsson, ...
Advanced Materials Interfaces 5 (15), 1800318, 2018
212018
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Articles 1–20