| Method of source terms for dipole emission modification in modes of arbitrary planar structures H Benisty, R Stanley, M Mayer JOSA A 15 (5), 1192-1201, 1998 | 338 | 1998 |
| Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging CJ Hang, CQ Wang, M Mayer, YH Tian, Y Zhou, HH Wang Microelectronics reliability 48 (3), 416-424, 2008 | 306 | 2008 |
| Influence of superimposed ultrasound on deformability of Cu H Huang, A Pequegnat, BH Chang, M Mayer, D Du, Y Zhou Journal of Applied Physics 106 (11), 113514, 2009 | 108 | 2009 |
| Effects of superimposed ultrasound on deformation of gold I Lum, H Huang, BH Chang, M Mayer, D Du, Y Zhou Journal of Applied Physics 105 (2), 024905, 2009 | 91 | 2009 |
| Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate I Lum, M Mayer, Y Zhou Journal of electronic materials 35 (3), 433-442, 2006 | 90 | 2006 |
| Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process M Mayer, O Paul, D Bolliger, H Baltes Components and Packaging Technologies, IEEE Transactions on 23 (2), 393-398, 2000 | 73 | 2000 |
| Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature Y Tian, C Wang, I Lum, M Mayer, JP Jung, Y Zhou Journal of Materials Processing Technology 208 (1), 179-186, 2008 | 65 | 2008 |
| Microstructural study of copper free air balls in thermosonic wire bonding CJ Hang, CQ Wang, YH Tian, M Mayer, Y Zhou Microelectronic engineering 85 (8), 1815-1819, 2008 | 64 | 2008 |
| In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon Microelectronic Engineering 85 (9), 1851-1857, 2008 | 63 | 2008 |
| Thermosonic ball bonding: friction model based on integrated microsensor measurements J Schwizer, M Mayer, D Bolliger, O Paul, H Baltes Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE …, 1999 | 59 | 1999 |
| Low-stress thermosonic copper ball bonding A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon IEEE Transactions on Electronics Packaging Manufacturing 32 (3), 176-184, 2009 | 57 | 2009 |
| Microelectronic bonding process monitoring by integrated sensors M Mayer Diss., Technische Wissenschaften ETH Zürich, Nr. 13685, 2000, 2000 | 54 | 2000 |
| Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force CJ Hang, WH Song, I Lum, M Mayer, Y Zhou, CQ Wang, JT Moon, ... Microelectronic engineering 86 (10), 2094-2103, 2009 | 48 | 2009 |
| Influence of mechanical stress on the offset voltage of Hall devices operated with spinning current method R Steiner, C Maier, M Mayer, S Bellekom, H Baltes Journal of microelectromechanical systems 8 (4), 466-472, 1999 | 47 | 1999 |
| Force sensors for microelectronic packaging applications J Schwizer, M Mayer, O Brand Springer, 2004 | 46 | 2004 |
| In situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors M Mayer, J Schwizer, O Paul, D Bolliger, H Baltes Advances in Electronic Packaging, EEP 26 (1), 973-978, 1999 | 46 | 1999 |
| Ultrasonic friction power during Al wire wedge-wedge bonding A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou Journal of applied physics 106 (1), 013503, 2009 | 43 | 2009 |
| Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon Microelectronics Reliability 51 (1), 67-74, 2011 | 39 | 2011 |
| Bonding wire characterization using automatic deformability measurement CJ Hang, I Lum, J Lee, M Mayer, CQ Wang, Y Zhou, SJ Hong, SM Lee Microelectronic Engineering 85 (8), 1795-1803, 2008 | 38 | 2008 |
| Electromigration of composite Sn-Ag-Cu solder bumps A Sharma, DE Xu, J Chow, M Mayer, HR Sohn, JP Jung Electronic Materials Letters 11 (6), 1072-1077, 2015 | 35 | 2015 |
Y Norman ZhouProfessor, Canada Research Chair in Adv. Mater. Joining & Processing, University of WaterlooBestätigte E-Mail-Adresse bei uwaterloo.ca
