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Co-authors
Jun ZhangHong Kong University of Science and Technology, IEEE FellowVerified email at ust.hk
Khaled B. LetaiefMember of US National Academy of Engineering and New Bright Professor of Engineering, HKUSTVerified email at ust.hk
Kaibin HuangProfessor, Dept. of EEE, The University of Hong Kong; IEEE Fellow; ISI Highly Cited ResearcherVerified email at eee.hku.hk
Changsheng You (游昌盛)Southern University of Science and TechnologyVerified email at sustech.edu.cn
Shenghui SongThe Hong Kong University of Science and TechnologyVerified email at ust.hk
Jiawei ShaoPh.D candidate, Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Juan Liu (Tasia)Ningbo UniversityVerified email at nbu.edu.cn
Yuchang SUNHKUSTVerified email at connect.ust.hk
Guanding YuZhejiang UniversityVerified email at zju.edu.cn
Caijun ZhongZhejiang UniversityVerified email at zju.edu.cn
Zhaoyang ZhangZhejiang UniversityVerified email at zju.edu.cn
Songze LiAssistant Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
Zihao WangHKUSTVerified email at cse.ust.hk
Dr. Bo BaiTheory Lab, Central Research Institute, 2012 Labs, Huawei Technologies Co., Ltd.Verified email at huawei.com
Zijian LiThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Wu HaoAssociate Professor, Dept. of Mathematical Sciences, Tsinghua Univ.Verified email at tsinghua.edu.cn