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Co-authors
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Ricky FuPlasma Technology Limited / City University of Hong KongVerified email at cityu.edu.hk
Kaifu HUOHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Shuilin WUHubei UniversityVerified email at hubu.edu.cn
Xuanyong LiuProfessor of Shanghai Institute of Ceramics, Chinese Academy of SciencesVerified email at mail.sic.ac.cn
Kenneth M C CheungChair Professor and Head of Department of Orthopaedics and Traumatology, University of Hong KongVerified email at hku.hk
Xuefeng Yu (喻学锋)Professor of Shenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Huaiyu WangShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Penghui LiShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Hoi Man WongThe University of Hong KongVerified email at hku.hk
Guosong WuHohai University, Nanjing, ChinaVerified email at hhu.edu.cn
Xiang PengWuhan Institute of TechnologyVerified email at wit.edu.cn
Tao HuAMATVerified email at amat.com
Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
Liuhe LiBeihang UniversityVerified email at buaa.edu.cn
Xuming Zhangwuhan university of science and technologyVerified email at wust.edu.cn
Yunchang xin重庆大学Verified email at cqu.edu.cn
Hao Huang (黄浩)Shenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
zhengwei wuustcVerified email at ustc.edu.cn
Paul K Chu
Chair Professor of Materials Engineering, City University of Hong Kong
Verified email at cityu.edu.hk - Homepage