Mark D Poliks
Title
Cited by
Cited by
Year
Study of the interlayer expansion mechanism and thermal–mechanical properties of surface-initiated epoxy nanocomposites
JS Chen, MD Poliks, CK Ober, Y Zhang, U Wiesner, E Giannelis
Polymer 43 (18), 4895-4904, 2002
2452002
Reworkable epoxies: thermosets with thermally cleavable groups for controlled network breakdown
S Yang, JS Chen, H Körner, T Breiner, CK Ober, MD Poliks
Chemistry of materials 10 (6), 1475-1482, 1998
1901998
Metallocene–methylaluminoxane catalysts for olefin polymerization. I. Trimethylaluminum as coactivator
JCW Chien, BP Wang
Journal of Polymer Science Part A: Polymer Chemistry 26 (11), 3089-3102, 1988
1841988
Multi-layered interconnect structure using liquid crystalline polymer dielectric
FD Egitto, DS Farquhar, VR Markovich, MD Poliks, DO Powell
US Patent 7,301,108, 2007
1532007
Flexible hybrid electronics: Direct interfacing of soft and hard electronics for wearable health monitoring
Y Khan, M Garg, Q Gui, M Schadt, A Gaikwad, D Han, NAD Yamamoto, ...
Advanced Functional Materials 26 (47), 8764-8775, 2016
1522016
Tamper-responding encapsulated enclosure having flexible protective mesh structure
DS Farquhar, C Feger, V Markovich, KI Papathomas, MD Poliks, JM Shaw, ...
US Patent 6,929,900, 2005
1502005
Characterization of thermally reworkable thermosets: materials for environmentally friendly processing and reuse
JS Chen, CK Ober, MD Poliks
Polymer 43 (1), 131-139, 2002
1362002
Conformation of microtubule-bound paclitaxel determined by fluorescence spectroscopy and REDOR NMR
Y Li, B Poliks, L Cegelski, M Poliks, Z Gryczynski, G Piszczek, PG Jagtap, ...
Biochemistry 39 (2), 281-291, 2000
1292000
Controlled degradation of epoxy networks: analysis of crosslink density and glass transition temperature changes in thermally reworkable thermosets
JS Chen, CK Ober, MD Poliks, Y Zhang, U Wiesner, C Cohen
Polymer 45 (6), 1939-1950, 2004
1132004
Dielectric composition and solder interconnection structure for its use
K Papathomas, MD Poliks, DW Wang, FR Christie
US Patent 5,194,930, 1993
1111993
Low CTE power and ground planes
RM Japp, MD Poliks
US Patent 6,329,603, 2001
812001
High-resolution carbon-13 and nitrogen-15 NMR investigations of the mechanism of the curing reactions of cyanate-based polymer resins in solution and the solid state
CA Fyfe, J Niu, SJ Rettig, NE Burlinson
Macromolecules 25 (23), 6289-6301, 1992
791992
Flexible chemiresistor sensors: thin film assemblies of nanoparticles on a polyethylene terephthalate substrate
L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ...
Journal of Materials Chemistry 20 (5), 907-915, 2010
662010
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
BE Curcio, PA Gruber, F Maurer, KI Papathomas, MD Poliks
US Patent 6,452,117, 2002
652002
NMR investigation of chain deformation in sheared polymer fluids
AI Nakatani, MD Poliks, ET Samulski
Macromolecules 23 (10), 2686-2692, 1990
621990
Polymer Science
JS Chen, MD Poliks, CK Ober, YM Zhang, U Wiesner, E Giannelis
Wiley & Sons 43, 48-95, 2002
612002
Electronic package utilizing protective coating
RD Havens, RM Japp, JA Knight, MD Poliks, AM Quinn
US Patent 6,351,030, 2002
582002
Conductive metal micro-pillars for enhanced electrical interconnection
RN Das, KI Papathomas, MD Poliks, VR Markovich
US Patent App. 13/082,502, 2012
542012
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane
RM Japp, MD Poliks
US Patent 6,722,031, 2004
52*2004
NMR investigations of the possible cross reactions between cyanate and epoxy resins
CA Fyee, J Niu, SJ Retting, DW Wang, MD Poliks
Journal of Polymer Science Part A: Polymer Chemistry 32 (12), 2203-2221, 1994
511994
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Articles 1–20