| Reliability of copper wire bonding in humidity environment H Liu, Z Zhao, Q Chen, J Zhou, M Du, S Kim, J Chae, M Chung 2011 IEEE 13th Electronics Packaging Technology Conference, 53-58, 2011 | 39 | 2011 |
| Reliability of Au-Ag alloy wire bonding H Liu, Q Chen, Z Zhao, Q Wang, J Zeng, J Chae, J Lee 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 20 | 2010 |
| MEMS piezoelectric resonant microphone array for lung sound classification H Liu, M Barekatain, A Roy, S Liu, Y Cao, Y Tang, A Shkel, ES Kim Journal of Micromechanics and Microengineering 33 (4), 044003, 2023 | 11 | 2023 |
| Active noise cancellation with MEMS resonant microphone array H Liu, S Liu, AA Shkel, ES Kim Journal of Microelectromechanical Systems 29 (5), 839-845, 2020 | 8 | 2020 |
| Investigation of various pad structure influence for copper wire bondability Q Chen, Z Zhao, H Liu, J Chae, S Kim, M Chung 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 8 | 2011 |
| Board level cyclic bending test for MCP package Z Jing, L Hai, J Lee 2007 9th Electronics Packaging Technology Conference, 459-462, 2007 | 7 | 2007 |
| Board level thermal cycle reliability of BGA for a new type of pad structure with OSP surface finish H Liu, J Zhang, S Chen, M Du, N Feng, Q Wang, T Lee 2007 8th International Conference on Electronic Packaging Technology, 1-3, 2007 | 7 | 2007 |
| Design optimization of microfabricated coils for volume-limited miniaturized broadband electromagnetic vibration energy harvester S Fan, Y Tang, L Zhao, H Liu, Y Wang, D Hou, Y Cao Energy Conversion and Management 271, 116299, 2022 | 6 | 2022 |
| Multi-band MEMS resonant microphone array for continuous lung-sound monitoring and classification H Liu, S Liu, AA Shkel, Y Tang, ES Kim 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems …, 2020 | 6 | 2020 |
| PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE H Liu US Patent US9504152B2, 2016 | 5 | 2016 |
| MEMS First-Order Bessel Beam Acoustic Transducer for Particle Trapping And Controllable Rotating J Li, Z Sun, Y Jia, T Li, H Lu, L Zhao, H Liu, S Liu 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems …, 2023 | 4 | 2023 |
| MEMS resonant microphone array for lung sound classification H Liu, S Liu, AA Shkel, Y Tang, ES Kim 2019 IEEE International Electron Devices Meeting (IEDM), 34.4. 1-34.4. 4, 2019 | 4 | 2019 |
| Wireless and Battery-Less Tamper Detection with Pyroelectric Energy Converter and High-Overtone Bulk Acoustic Resonator M Barekatain, H Liu, ES Kim IEEE Sensors Journal 22 (14), 14639-14646, 2022 | 3 | 2022 |
| MEMS Bessel Beam Acoustic Transducer (MEMS-BBAT) with Air-Cavity Lens Based on Spiral Diffraction Grating for Particle Trapping Y Jia, Z Sun, J Li, L Zhao, H Liu, T Li, S Liu 2022 IEEE International Ultrasonics Symposium (IUS), 1-4, 2022 | 2 | 2022 |
| Particle Trapping and Transportation with MEMS Zeroth-order Bessel Beam Acoustic Transducer (BBAT) Z Sun, J Li, Y Jia, Y Liu, K Lyu, H Liu, H Su, T Li, S Liu 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO), 1-6, 2022 | 1 | 2022 |
| Methods of manufacturing printed circuit board and semiconductor package H Liu US Patent 10,049,970, 2018 | 1 | 2018 |
| Wearable Stethoscope Based on Resonant Microphone Array with Wireless Data Transfer A Sengupta, A Roy, H Gao, M Barekatain, H Liu, ES Kim 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems …, 2024 | | 2024 |
| Twin Trap Acoustic Transducer with PDMS Fresnel Lens for Particle Trapping J Li, Z Sun, H Liu, L Zhao, T Li, S Liu 2023 IEEE International Ultrasonics Symposium (IUS), 1-4, 2023 | | 2023 |
| Ultrasonic Transducer encoding intersecting Bessel beams for particle patterning Z Sun, J Li, H Liu, L Zhao, T Li, S Liu 2023 IEEE International Ultrasonics Symposium (IUS), 1-4, 2023 | | 2023 |
| Rotation-free high order Bessel beam acoustic transducer for particle trapping Z Sun, J Li, H Liu, L Zhao, T Li, S Liu 2023 IEEE International Ultrasonics Symposium (IUS), 1-4, 2023 | | 2023 |
