Ahmed Sharif (ORCID:0000-0002-1592-018X)
Ahmed Sharif (ORCID:0000-0002-1592-018X)
Department of Materials and Metallurgical Engineering, BUET, BANGLADESH
ยืนยันอีเมลแล้วที่ mme.buet.ac.bd
ชื่ออ้างโดยปี
Study on wear properties of aluminium–silicon piston alloy
MM Haque, A Sharif
Journal of Materials Processing Technology 118, 69–73, 2001
1542001
Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging
MN Islam, A Sharif, YC Chan
Journal of electronic materials 34 (2), 143-149, 2005
1052005
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3. 5Ag0. 5Cu solder alloy
MN Islam, YC Chan, A Sharif, MO Alam
Microelectronics Reliability 43 (12), 2031-2037, 2003
852003
The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads
AK Gain, T Fouzder, YC Chan, A Sharif, NB Wong, WKC Yung
Journal of Alloys and Compounds 506 (1), 216-223, 2010
832010
Interfacial reactions of BGA Sn–3.5% Ag–0.5% Cu and Sn–3.5% Ag solders during high-temperature aging with Ni/Au metallization
A Sharif, MN Islam, YC Chan
Materials science and engineering: B 113 (3), 184-189, 2004
832004
Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging
A Sharif, YC Chan, RA Islam
Materials Science and Engineering: B 106 (2), 120-125, 2004
772004
Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization
A Sharif, YC Chan
Journal of Alloys and Compounds 390 (1-2), 67-73, 2005
752005
Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow
A Sharif, YC Chan
Materials Science and Engineering: B 106 (2), 126-131, 2004
752004
Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
T Fouzder, I Shafiq, YC Chan, A Sharif, WKC Yung
Journal of Alloys and Compounds 509 (5), 1885-1892, 2011
692011
Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy
SK Das, A Sharif, YC Chan, NB Wong, WKC Yung
Journal of Alloys and Compounds 481 (1-2), 167-172, 2009
592009
Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages
AK Gain, YC Chan, WKC Yung
Materials Science and Engineering: B 162 (2), 92-98, 2009
582009
Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties
MM Billah, KM Shorowordi, A Sharif
Journal of Alloys and Compounds 585, 32-39, 2014
522014
Dissolution of electroless Ni metallization by lead-free solder alloys
A Sharif, YC Chan, MN Islam, MJ Rizvi
Journal of Alloys and Compounds 388 (1), 75-82, 2005
522005
Transient liquid phase Ag-based solder technology for high-temperature packaging applications
A Sharif, CL Gan, Z Chen
Journal of Alloys and Compounds 587, 365-368, 2014
512014
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages
AK Gain, YC Chan, A Sharif, NB Wong, WKC Yung
Microelectronics Reliability 49 (7), 746-753, 2009
512009
Clinical and immunological aspects of post–kala-azar dermal leishmaniasis in Bangladesh
S Islam, E Kenah, MAA Bhuiyan, KM Rahman, B Goodhew, CM Ghalib, ...
The American journal of tropical medicine and hygiene 89 (2), 345-353, 2013
49*2013
The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing
MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif
Soldering & Surface Mount Technology 17 (2), 40-48, 2005
452005
Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints
A Sharif, YC Chan
Microelectronic Engineering 84 (2), 328-335, 2007
432007
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads
T Fouzder, AK Gain, YC Chan, A Sharif, WKC Yung
Microelectronics Reliability 50 (12), 2051-2058, 2010
412010
Liquid and solid state interfacial reactions of Sn–Ag–Cu and Sn–In–Ag–Cu solders with Ni–P under bump metallization
A Sharif, YC Chan
Thin Solid Films 504 (1-2), 431-435, 2006
402006
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บทความ 1–20