Thorben Casper
Title
Cited by
Cited by
Year
Electrothermal simulation of bonding wire degradation under uncertain geometries
T Casper, H De Gersem, R Gillon, T Gotthans, T Kratochvil, P Meuris, ...
2016 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2016
222016
Nanoelectronic COupled problems solutions-nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation
EJW ter Maten, PA Putek, M Guenther, R Pulch, C Tischendorf, C Strohm, ...
Journal of Mathematics in Industry 7 (1), 1-19, 2016
162016
High‐dimensional uncertainty quantification for an electrothermal field problem using stochastic collocation on sparse grids and tensor train decompositions
D Loukrezis, U Römer, T Casper, S Schöps, H De Gersem
International Journal of Numerical Modelling: Electronic Networks, Devices …, 2018
102018
Automatic generation of equivalent electrothermal SPICE netlists from 3D electrothermal field models
T Casper, H De Gersem, S Schöps
2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016
62016
Proper generalized decomposition of parameterized electrothermal problems discretized by the finite integration technique
A Krimm, T Casper, S Schöps, H De Gersem, L Chamoin
IEEE Transactions on Magnetics 55 (6), 1-4, 2019
42019
Increasing EM robustness of placement and routing solutions based on layout-driven discretization
S Bigalke, J Lienig, T Casper, S Schöps
2018 14th Conference on Ph. D. Research in Microelectronics and Electronics …, 2018
42018
Automated netlist generation for 3D electrothermal and electromagnetic field problems
T Casper, D Duque, S Schöps, H De Gersem
Journal of Computational Electronics 18 (4), 1306-1332, 2019
32019
Determination of bond wire failure probabilities in microelectronic packages
T Casper, U Römer, S Schöps
2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016
32016
Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging
T Casper, U Römer, H De Gersem, S Schöps
Computers & Mathematics with Applications 79 (6), 1781-1801, 2020
22020
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements
K Hirmer, K Hofmann, T Casper, S Schöps
2019 Kleinheubach Conference, 1-4, 2019
12019
Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities
T Casper
Technische Universität, 2019
2019
Bond Wire Models
DJD Guerra, T Casper, S Schöps, H De Gersem, U Römer, R Gillon, ...
Nanoelectronic Coupled Problems Solutions, 43-68, 2019
2019
Automated Generation of Netlists from Electrothermal Field Models
T Casper, DJD Guerra, S Schöps, H De Gersem
Nanoelectronic Coupled Problems Solutions, 93-113, 2019
2019
Proper Generalized Decomposition of parameterized electrothermal problems for finite integration solvers
A Krimm, T Casper, H de Gersem, L Chamoin
18th IEEE Conference on Electromagnetic Field Computation-CEFC2018, 2018
2018
Nanoelectronic COupled Problems Solutions-nanoCOPS
EJW ter Maten, P Putek, M Günther, C Tischendorf, C Strohm, ...
2015
An Electrothermal Lumped Modeling Approach for Thin Bond Wires in Microelectronic Chip Packages
T Casper, U Römer, S Schöps
The system can't perform the operation now. Try again later.
Articles 1–16