| Electrothermal simulation of bonding wire degradation under uncertain geometries T Casper, H De Gersem, R Gillon, T Gotthans, T Kratochvil, P Meuris, ... 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2016 | 24 | 2016 |
| Nanoelectronic COupled problems solutions-nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation EJW ter Maten, PA Putek, M Günther, R Pulch, C Tischendorf, C Strohm, ... Journal of Mathematics in Industry 7, 1-19, 2016 | 20 | 2016 |
| High‐dimensional uncertainty quantification for an electrothermal field problem using stochastic collocation on sparse grids and tensor train decompositions D Loukrezis, U Römer, T Casper, S Schöps, H De Gersem International Journal of Numerical Modelling: Electronic Networks, Devices …, 2018 | 13 | 2018 |
| Proper generalized decomposition of parameterized electrothermal problems discretized by the finite integration technique A Krimm, T Casper, S Schöps, H De Gersem, L Chamoin IEEE Transactions on Magnetics 55 (6), 1-4, 2019 | 9 | 2019 |
| Automatic generation of equivalent electrothermal SPICE netlists from 3D electrothermal field models T Casper, H De Gersem, S Schöps 2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016 | 6 | 2016 |
| Automated netlist generation for 3D electrothermal and electromagnetic field problems T Casper, D Duque, S Schöps, H De Gersem Journal of Computational Electronics 18 (4), 1306-1332, 2019 | 5 | 2019 |
| Increasing EM robustness of placement and routing solutions based on layout-driven discretization S Bigalke, J Lienig, T Casper, S Schöps 2018 14th Conference on Ph. D. Research in Microelectronics and Electronics …, 2018 | 5 | 2018 |
| Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging T Casper, U Römer, H De Gersem, S Schöps Computers & Mathematics with Applications 79 (6), 1781-1801, 2020 | 4 | 2020 |
| Determination of bond wire failure probabilities in microelectronic packages T Casper, U Römer, S Schöps 2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016 | 4 | 2016 |
| 3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements K Hirmer, K Hofmann, T Casper, S Schöps 2019 Kleinheubach Conference, 1-4, 2019 | 1 | 2019 |
| Electrothermal Field and Circuit Simulation of Thin Wires and Evaluation of Failure Probabilities T Casper Technische Universität, 2019 | | 2019 |
| Bond Wire Models DJD Guerra, T Casper, S Schöps, H De Gersem, U Römer, R Gillon, ... Nanoelectronic Coupled Problems Solutions, 43-68, 2019 | | 2019 |
| Automated Generation of Netlists from Electrothermal Field Models T Casper, DJ Duque Guerra, S Schöps, H De Gersem Nanoelectronic Coupled Problems Solutions, 93-113, 2019 | | 2019 |
| Proper Generalized Decomposition of parameterized electrothermal problems for finite integration solvers A Krimm, T Casper, H de Gersem, L Chamoin 18th IEEE Conference on Electromagnetic Field Computation-CEFC2018, 2018 | | 2018 |
| Nanoelectronic COupled Problems Solutions-nanoCOPS EJW ter Maten, P Putek, M Günther, C Tischendorf, C Strohm, ... | | 2015 |
| An Electrothermal Lumped Modeling Approach for Thin Bond Wires in Microelectronic Chip Packages T Casper, U Römer, S Schöps | | |
Herbert De GersemInstitut für Theorie Elektromagnetischer Felder, TU DarmstadtVerified email at temf.tu-darmstadt.de
